Metallization and three dimensional packaging for MEMS applications

微机电系统或MEMS通常涉及通过利用微制造技术将机械元件、传感器、致动器和电子器件集成在诸如晶片的公共硅衬底上。MEMS被设想为通过将硅基微电子技术与微机械加工技术结合在一起来彻底改变几乎每一种微器件产品类别。通过这种方式，MEMS使完整的片上系统概念的实现成为可能。因此，MEMS器件的商业潜力在当前市场上实际上是无限的。MEMS器件的封装是关键的加工步骤。MEMS器件是精密的结构，因此除了提供电气互连外，封装通常还需要提供机械和环境保护。许多MEMS封装是特定于器件的，这可能是昂贵的，占系统成本的90%。降低成本的一种方法是通过使用晶圆级封装。在该方法中，在晶片上制造的MEMS器件在将晶片分割成单个器件之前直接接合到覆盖晶片。晶圆级MEMS封装可以提供密封保护或提供受控的介质访问。Micralyne是加拿大领先的MEMS代工厂，需要降低生产成本，以保持国内和全球竞争力，并增加市场份额。

Micro-electro-mechanical systems or MEMS typically involve the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, such as a wafer, through the utilization of micro-fabrication techniques. MEMS are envisaged to revolutionize nearly every micro-device product category by bringing together silicon-based microelectronics with micromachining technologies. In this way, MEMS make possible the realization of the concept of complete ystems-on-a-chip. As a result, the commercial potential of MEMS devices is practically boundless in the current marketplace. Packaging of MEMS devices is a crucial processing step. MEMS devices are delicate structures, so that in addition to providing electrical interconnection, the package often needs to provide mechanical and environmental protection. Many MEMS packages are device specific, which can be costly, accounting for up to 90% of the system costs. One way of reducing costs is through the use of wafer-level packaging. In this method, the MEMS devices, which are fabricated on a wafer, are bonded directly to a capping wafer prior to sectioning of the wafer into individual devices. Wafer-level MEMS packaging can provide hermetic protection or provide controlled media access. Micralyne is a leading Canadian MEMS foundry, and needs to reduce production costs as a way to remain competitive, both nationally and globally, and to increase their market share.