Metallization and three dimensional packaging for MEMS applications

微电子机械系统或MEMS通常涉及通过利用微制造技术将机械元件、传感器、致动器和电子设备集成在诸如晶片等普通硅衬底上。通过将硅基微电子技术与微机械加工技术相结合，MEMS被设想为几乎每一种微设备产品类别的革命性变化。通过这种方式，MEMS使完整的片上系统概念的实现成为可能。因此，在目前的市场上，MEMS器件的商业潜力几乎是无限的。MEMS器件的封装是一个关键的加工步骤。MEMS器件是微妙的结构，因此除了提供电气互连外，封装通常还需要提供机械和环境保护。许多MEMS封装是特定于器件的，这可能很昂贵，占系统成本的90%。降低成本的一种方法是使用晶圆级封装。在这种方法中，在晶片上制造的MEMS器件在将晶片分割成单独的器件之前被直接结合到封口晶片上。晶圆级MEMS封装可以提供密封保护或提供受控的介质访问。Micralyne是加拿大领先的MEMS代工厂，需要降低生产成本，以保持在国内和全球的竞争力，并增加其市场份额。

Micro-electro-mechanical systems or MEMS typically involve the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, such as a wafer, through the utilization of micro-fabrication techniques. MEMS are envisaged to revolutionize nearly every micro-device product category by bringing together silicon-based microelectronics with micromachining technologies. In this way, MEMS make possible the realization of the concept of complete ystems-on-a-chip. As a result, the commercial potential of MEMS devices is practically boundless in the current marketplace. Packaging of MEMS devices is a crucial processing step. MEMS devices are delicate structures, so that in addition to providing electrical interconnection, the package often needs to provide mechanical and environmental protection. Many MEMS packages are device specific, which can be costly, accounting for up to 90% of the system costs. One way of reducing costs is through the use of wafer-level packaging. In this method, the MEMS devices, which are fabricated on a wafer, are bonded directly to a capping wafer prior to sectioning of the wafer into individual devices. Wafer-level MEMS packaging can provide hermetic protection or provide controlled media access. Micralyne is a leading Canadian MEMS foundry, and needs to reduce production costs as a way to remain competitive, both nationally and globally, and to increase their market share.