单片集成波长可调谐少模光发射芯片

以数据中心、接入网为代表的中短距数据通信已经成为光通信传输速率提升的重要推动力。在即将部署的400G系统中已经开始采用波分复用（WDM）和高阶PAM-4调制格式的手段。但在未来更高速率的800G以上应用中，还需在WDM+PAM-4技术外引入新的技术才能满足长期需求。...为满足更高的调制速率及谱效率、更低的技术复杂度和器件成本需求，我们提出将模分复用（MDM）及波长可调谐技术引入中短距通信及片上互连。拟研制基于磷化铟（InP）光子集成技术的波长可调谐少模光发射芯片。该发射芯片将集成波长可调谐直调激光器与基于多模干涉耦合器（MMI）的模式转换复用器，可以实现波长可调谐的WDM+MDM+PAM-4片上光发射功能。...该方案可以兼顾中短距应用对调制速率、谱效率、技术复杂度和部署密度的需求，兼容InP基标准代工工艺，有望实现低成本、批量化生产，为未来高速通信提供有益技术参考。

Driven by the demands of high transmission capacity, data centers, access networks, and optical interconnections have become an important driving force for increasing the transmission rate. Higher modulation rates and spectral efficiency, lower technical complexity, and low-cost requirements resulted in the adoption of PAM-4 modulation formats in 400G systems, in addition to the existing wavelength division multiplexing (WDM) technology. However, in the future applications of beyond 400G, it is necessary to introduce new multiplexing technologies to meet long-term requirements. ..In this project, we propose to introduce mode division multiplexing (MDM) technology into short-to-medium-range communications and on-chip interconnections to increase the flexibility of deployment and reduce system costs with the assistance of wavelength-tunable technology. We will develop a wavelength-tunable high-linearity direct-modulated few-mode transmitter based on indium phosphide photonic integrated technology. A wavelength tunable high-linearity direct-modulated laser, a mode converter-multiplexer will be integrated on the same chip. In medium and short-distance applications, this solution can meet the requirement of modulation rate, spectral efficiency, technical complexity, and deployment density. It is compatible with InP-based standard foundry processes and is expected to achieve low-cost, mass production, providing strong technical support for future high-speed communications.