Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect
Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect
复制标题
考虑电流弯曲效应的各向异性导电胶颗粒的体电阻评估
DOI:
10.1115/1.4006889
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发表时间:
2012-09
期刊:
影响因子:
--
通讯作者:
Yin zhouping
中科院分区:
文献类型:
--
作者:
chen xiancai;Tao bo;Yin zhouping
Because it is difficult to accurately estimate the electric resistance of anisotropic conductive adhesive (ACA) joints, the ACA’s applications in high density packaging field have been greatly limited. The bulk resistance of particles is an essential part of the resistance of ACA joints. For the ACA using solid nickel (Ni) particles, because current flows along the spherical profile of the particles, the bulk resistance of these particles will be underestimated if the current bending effect is neglected. Here we propose a new method, which considers this current bending effect, to accurately evaluate the bulk resistance of Ni particles. First, a mathematical model to calculate the resistance of an arbitrary shaped resistor is deduced on the basis of electromagnetic theory. Second, a numerical model is introduced to calculate the potential distribution in the particles. Finally, the bulk resistance calculated by the new model is compared with the conventional methods. It is shown that the value obtained from this model is much higher than those calculated by other methods. Furthermore, the correlation studies between the bulk resistance and the particle’s diameter, the deformation degree, and the bonding force are carried out. And the results show that these three parameters influence significantly on the bulk resistance. In conclusion, to obtain accurate bulk resistance of ACA particles and make them stable and reliable, it is important to take the current bending effect into consideration and control the particle diameter and the bonding force properly.
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影响因子:
1.6
作者:
G. Dou;Y. Chan;Johan Liu
通讯作者:
G. Dou;Y. Chan;Johan Liu
DOI:
10.1109/polytr.2004.1402752
发表时间:
2004-09
期刊:
4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.
影响因子:
--
作者:
G. Don;D. Whalley;Changqing Liu
通讯作者:
G. Don;D. Whalley;Changqing Liu
DOI:
10.1109/tcapt.2008.916802
发表时间:
2008-05
影响因子:
--
作者:
B. Xie;Xunqing Shi;H. Ding
通讯作者:
B. Xie;Xunqing Shi;H. Ding
DOI:
10.1109/pep.1997.656495
发表时间:
1997-10
期刊:
Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)
影响因子:
--
作者:
M. Yim;K. Paik
通讯作者:
M. Yim;K. Paik
影响因子:
3.2
作者:
H. L. Leong;C. Gan;R. I. Made;C. Thompson;K. Pey;Hongyu Li
通讯作者:
H. L. Leong;C. Gan;R. I. Made;C. Thompson;K. Pey;Hongyu Li