Surface microfabrication using coaxial waterjet assisted laser-induced plasma micromachining

Surface microfabrication using coaxial waterjet assisted laser-induced plasma micromachining
复制标题

使用同轴水射流辅助激光诱导等离子体微加工进行表面微加工

DOI:
10.1016/j.optlastec.2021.107446
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发表时间:
2021-12
影响因子:
5
通讯作者:
Wenwu Zhang
Wenwu Zhang
中科院分区:
物理与天体物理2区
文献类型:
--
作者:
Haitao Wang;Yufeng Wang;Bin Wang;Yang Liu;Wenwu Zhang

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本文提出了一种新型同轴水辅助激光诱导等离子体微加工方法。在CW-LIPM中,波长为532 nm的脉冲激光束聚焦在同轴水射流中,导致光学击穿和随后形成的局部等离子体羽流。与常规激光加工相比,CW-LIPM可以在保持加工分辨率和加工精度的前提下获得更清洁的表面。研究了CW-LIPM的机理以及微气泡爆炸对加工区入口附近工件表面粗糙度的影响。利用所研制的实验装置,研究了单脉冲激光能量、脉冲重复频率和水射流速度对等离子体分布的影响。此外,考虑到微空化气泡在工件表面附近由于压力差而发生爆炸,研究了水射流速度对空化气泡分布的影响以及空化气泡相对位置对加工微通道加工质量的影响。与空气中的激光微加工相比,CW-LIPM可以加工无突起且精度更高的微结构。采用较高的射流速度、较低的单脉冲能量、多道次扫描、加工位置距等离子体中心2-3 mm、距底部4-5 mm的组合方式,可以获得高质量的表面微结构。激光诱导的等离子体分布是不对称的,并且下半部分等离子体由于其聚焦形状而更适合于精密加工,这是优选的,以增强所提出的CW-LIPM工艺的局部化。
In this study, a novel coaxial water assisted laser-induced plasma micromachining (CW-LIPM) method was studied to process microstructures on the workpiece surface. In CW-LIPM, a pulsed laser beam with a wavelength 532 nm was focused within a coaxial water jet, leading to the optical breakdown and the subsequent formation of the localized plasma plume. Compared with conventional laser processing, a cleaner surface could be acquired by CW-LIPM, while maintaining the machining resolution and processing accuracy. The mechanism of CW-LIPM and the effects of microbubble explosions on the surface roughness of the workpiece in proximity to the entrance of the processing area have been studied. With the developed experimental setup, the influence of single laser pulse energy, pulse repetition frequency, and water-jet velocity on the plasma distribution was also researched. Moreover, the effects of waterjet speed on the distribution of cavitation bubbles and the relative position on the machining quality of the processed microchannels were also studied, considering the explosions of the micro cavitation bubbles near the workpiece surface due to the pressure difference. Compared with laser micromachining in the air, CW-LIPM could process microstructures with no protrusions and better precision. High-quality surface microstructures could be obtained by combining the higher-velocity waterjet, the lower single pulse energy, multiple scanning passes, and the processing positions 2–3 mm down from the plasma center and 4–5 mm above the bottom. The laser-induced plasma distribution was asymmetric, and the lower half plasma was more suitable for precision processing due to its focused shape, which is preferred to enhance the localization of the proposed CW-LIPM process.
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