Functionally Graded W-Cu Materials Prepared from Cu-Coated W Powders by Microwave Sintering
Functionally Graded W-Cu Materials Prepared from Cu-Coated W Powders by Microwave Sintering
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微波烧结铜包钨粉制备功能梯度钨铜材料
DOI：
10.1007/s11665-019-04321-7
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发表时间：
2019-10
影响因子：
2.3
通讯作者：
Cheng Jigui
中科院分区：
文献类型：
--
作者：
Chen Wenchao;Chen Pengqi;Li Jianfeng;Zhang Jianhua;Luo Laima;Cheng Jigui
将不同Cu含量（10-30 wt.%）的Cu包覆W复合粉末采用层压法制备了三层W-Cu（W-10 Cu/W-20 Cu/W-30 Cu，wt %）功能梯度材料Cu）和W的颗粒尺寸以及粉末压坯的微波烧结。研究了梯度材料的显微组织和物理力学性能。实验结果表明，在1250 °C烧结20 min后，梯度W-Cu试样的相对密度可达97%以上。Cu在厚度方向上呈梯度层状分布，梯度样品中各层之间结合良好。此外，梯度W-Cu材料具有良好的物理和机械性能。烧结样品的热导率超过210 W m K-1，最大抗弯强度和硬度分别达到1004 MPa和346 HV。研究结果表明，采用叠层压制和微波烧结相结合的方法可以成功制备出密度高、Cu和W分布梯度、性能优良的W-Cu功能梯度材料。
Three-layered W-Cu (W-10Cu/W-20Cu/W-30Cu, weight percentage) functionally graded materials were fabricated by laminate pressing of Cu-coated W composite powders with different Cu contents (10-30 wt.% Cu) and W particle sizes in the powders and microwave sintering of the powder compacts. The microstructure and the physical and mechanical properties of the graded materials were investigated. The experimental results show that the relative density of the graded W-Cu samples sintered at 1250 °C for 20 min is above 97%. Cu has a gradient layer distribution in the thickness direction, and there is good combination between the layers in the graded samples. Furthermore, the graded W-Cu materials exhibit good physical and mechanical properties. The sintered samples have thermal conductivities above 210 W m K−1, and the maximum bending strength and hardness reach 1004 MPa and 346 HV, respectively. The present results show that functionally graded W-Cu materials with high density, gradient Cu and W distribution, and good properties can be successfully prepared by laminate pressing and microwave sintering.
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化学镀制备W≤30Cu复合粉末的烧结行为
DOI：
10.1016/j.ijrmhm.2013.10.012
发表时间：
2014
影响因子：
3.6
作者：
Xiao-Yong Zhu;Xiang Zan;Guang-Nan Luo;Yu-Cheng Wu
通讯作者：
Yu-Cheng Wu
DOI：
10.1002/chin.201021216
发表时间：
2010-04
期刊：
ChemInform
影响因子：
--
作者：
M. Oghbaei;O. Mirzaee
通讯作者：
M. Oghbaei;O. Mirzaee
影响因子：
2.3
作者：
M. Morales;E. Xuriguera;M. Martínez;J. A. Padilla;J. Molera;N. Ferrer;M. Segarra;F. Espiell
通讯作者：
M. Morales;E. Xuriguera;M. Martínez;J. A. Padilla;J. Molera;N. Ferrer;M. Segarra;F. Espiell
影响因子：
6.2
作者：
Jigui Cheng;Chun-yi Lei;Ertao Xiong;Yang Jiang;Yonghong Xia
通讯作者：
Jigui Cheng;Chun-yi Lei;Ertao Xiong;Yang Jiang;Yonghong Xia
影响因子：
8.4
作者：
Ibrahim, A.;Abdallah, M.;Hegazy, A. Abousree
通讯作者：
Hegazy, A. Abousree