Friction Stir Spot Welding-Brazing of Al and Hot-Dip Aluminized Ti Alloy with Zn Interlayer
Friction Stir Spot Welding-Brazing of Al and Hot-Dip Aluminized Ti Alloy with Zn Interlayer
复制标题
铝与锌夹层热浸渗铝钛合金的搅拌摩擦点焊-钎焊
作者：
周兴汶;陈玉华;李树寒;黄永德;郝坤;彭鹏
铝钛合金搅拌摩擦点焊在航空航天和汽车工业中有着广泛的应用，但其连接面积小，限制了接头力学性能的提高。在本研究中，在Ti6Al4V合金上通过热浸法制备了一层al涂层，然后在搅拌摩擦连接中使用Zn中间层，将涂层Ti合金与2014-Al合金以搭接形式连接，在搅拌区外引入钎焊区，增加连接面积。对接头的微观组织进行了研究，并与传统FSSW接头的强度进行了比较，证实了新工艺的优越性。由于连接面积的增加，在相同焊接参数下，该接头的最大断裂载荷比传统FSSW接头高110%。这些接头的断裂载荷取决于连接宽度，包括搅拌区内的固相结合区宽度和搅拌区外的钎焊区宽度。
Friction stir spot welding (FSSW) of Al to Ti alloys has broad applications in the aerospace and automobile industries, while its narrow joining area limits the improvement of mechanical properties of the joint. In the current study, an Al-coating was prepared on Ti6Al4V alloy by hot-dipping prior to joining, then a Zn interlayer was used during friction stir joining of as-coated Ti alloy to the 2014-Al alloy in a lap configuration to introduce a brazing zone out of the stir zone to increase the joining area. The microstructure of the joint was investigated, and the joint strength was compared with the traditional FSSW joint to confirm the advantages of this new process. Because of the increase of the joining area, the maximum fracture load of such joint is 110% higher than that of the traditional FSSW joint under the same welding parameters. The fracture load of these joints depends on the joining width, including the width of solid-state bonding region in stir zone and brazing region out of stir zone.
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影响因子：
3.3
作者：
Xu R. Z.;Ni D. R.;Yang Q.;Liu C. Z.;Ma Z. Y.
通讯作者：
Ma Z. Y.
DOI：
10.1016/j.msea.2013.01.047
发表时间：
2013-04
影响因子：
6.4
作者：
S. Lv;Cui Qinglong;Yongxian Huang;J. Xiaojun
通讯作者：
S. Lv;Cui Qinglong;Yongxian Huang;J. Xiaojun
DOI：
10.1002/9783527813964.ch12
发表时间：
2019-03
期刊：
Harsh Environment Electronics
影响因子：
--
作者：
Tariq Islam;A. Sharif
通讯作者：
Tariq Islam;A. Sharif
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影响因子：
3
作者：
Huang, Yongxian;Lv, Zongliang;dos Santos, Jorge F.
通讯作者：
dos Santos, Jorge F.
影响因子：
1.6
作者：
M. Swamy;S. Muthukumaran;K. Kiran
通讯作者：
M. Swamy;S. Muthukumaran;K. Kiran