Continuous contact problem of thermoelectric layer pressed by rigid punch
Continuous contact problem of thermoelectric layer pressed by rigid punch
复制标题
刚性冲头压制热电层的连续接触问题
DOI：
10.1016/j.apm.2021.07.029
复制
发表时间：
2021-12
影响因子：
5
通讯作者：
Ding Shenghu
中科院分区：
文献类型：
--
作者：
Zhang Chenxi;Ding Shenghu
在这项研究中，热电层的连续接触问题搁置在一个刚性基板和加载的刚性冲压检查。考虑热电层的体积力，建立了热电层与刚性层之间的应力分布模型。给出了热电层与衬底间应力的一般表达式。利用边界条件，得到了应力分布的奇异积分方程，并用Gauss-Chebyshev积分公式求解。得到了刚性凸模与热电层之间应力分布的数值结果。研究发现，刚性冲头与热电层之间的应力在刚性冲头的边缘处表现出奇异性。分析了刚性冲头和热电层参数对热电层与基板间临界载荷因子的影响。结果表明，较大的刚性冲头宽度和热电层的体积力使热电层与刚性基底分离困难。本文的研究结果将为研究热电材料的接触行为提供参考。
In this study, the continuous contact problem of thermoelectric layer resting on a rigid substrate and loaded by a rigid punch is examined. Considering the body force of the thermoelectric layer, the model of stress distribution between thermoelectric layer and rigid layer is established. The general expressions for the stress between the thermoelectric layer and the substrate are given. Using the boundary conditions, the singular integral equation of the stress distribution is obtained and solved by Gauss-Chebyshev integral formula. The numerical results of the stress distribution between the rigid punch and the thermoelectric layer are obtained. It is found that the stress between the rigid punch and the thermoelectric layer exhibits singularity at the edge of the rigid punch. The influence of the parameters of the rigid punch and the thermoelectric layer on the critical load factor between the thermoelectric layer and the substrate is analyzed. The results show that the larger rigid punch width and the body force of the thermoelectric layer make it difficult to separate the thermoelectric layer from the rigid substrate. The results of this paper will provide a reference for studying the contact behavior of thermoelectric materials.
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影响因子：
2.2
作者：
A. Birinci;R. Erdol
通讯作者：
A. Birinci;R. Erdol
影响因子：
2.8
作者：
S. Kuznetsov
通讯作者：
S. Kuznetsov
DOI：
10.1016/j.microrel.2006.07.057
发表时间：
2006-09
期刊：
Microelectron. Reliab.
影响因子：
--
作者：
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通讯作者：
L. Dupont;Z. Khatir;S. Lefebvre;S. Bontemps
影响因子：
3.6
作者：
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通讯作者：
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影响因子：
0.8
作者：
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通讯作者：
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