System-in-silicon architecture and its application to H.264/AVC motion estimation for 1080HDTV

System-in-silicon architecture and its application to H.264/AVC motion estimation for 1080HDTV
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硅片系统架构及其在 1080HDTV 的 H.264/AVC 运动估计中的应用

DOI:
10.1109/isscc.2006.1696226
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发表时间:
2006
期刊:
2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers
影响因子:
--
通讯作者:
Kenji Yoshida
Kenji Yoshida
中科院分区:
--
文献类型:
--
作者:
K. Kumagai;Changqi Yang;H. Izumino;Nobuyuki Narita;Keisuke Shinjo;Shin;Y. Nakaoka;Tomohiro Kawamura;Hideo Komabashiri;Tsukasa Minato;Atsushi Ambo;Takamasa Suzuki;Zhenyu Liu;Yang Song;S. Goto;T. Ikenaga;Yoshihiro Mabuchi;Kenji Yoshida

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硅系统(SiS)是一种多芯片架构,以低功耗实现逻辑和存储器之间的宽带宽通信。介绍了SiS在H.264/AVC运动估计中的应用。 DRAM集成了23.1 Gb/s的带宽和1.6pJ/b的数据传输效率,实现了263.1GB/s的实时1080HDTV处理。作者提出了一种具有 1024b 芯片间总线的硅内系统架构,可在逻辑和存储器之间提供高带宽低功耗连接。高度并行架构还允许低频 (25MHz) 操作,同时实现 1080HDTV 的实时运动估计。该解决方案以 190mW 的功率水平实现了运动估计所需的 23.1 Gb/s 带宽和相关处理
System-in-silicon (SiS) is a multi-chip architecture to realize wide bandwidth communication between logic and memory with low power. The application of SiS to H.264/AVC motion estimation is presented. DRAM is integrated with 23.1 Gb/s bandwidth and 1.6pJ/b data transfer efficiency, realizing real-time 1080HDTV processing with 263.1GB/s. The authors present a system-in-silicon architecture with 1024b inter-chip bus to provide high-bandwidth low-power connectivity between logic and memory. The highly parallel architecture also allows low frequency (25MHz) operation while achieving real-time motion estimation for 1080HDTV. The solution achieves the required 23.1 Gb/s bandwidth and associated processing for motion estimation at a power level of 190mW
具有发射功率控制方案的 195Gb/s 1.2W 3D 堆叠感应片间无线超级连接
DOI: --
发表时间: 2004
期刊: IEEE International Solid-State Circuits Conference (ISSCC' 05) Dig. Tech. Papers
影响因子: --
作者:
R. Ono;K. Takezawa;Y. Yamashita;T. Oda;N.Miura 他
通讯作者: N.Miura 他