Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials.
Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials.
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DOI：
10.1126/sciadv.1601014
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发表时间：
2016-09
期刊：
影响因子：
13.6
通讯作者：
Rogers JA
中科院分区：
文献类型：
--
作者：
Yan Z;Zhang F;Liu F;Han M;Ou D;Liu Y;Lin Q;Guo X;Fu H;Xie Z;Gao M;Huang Y;Kim J;Qiu Y;Nan K;Kim J;Gutruf P;Luo H;Zhao A;Hwang KC;Huang Y;Zhang Y;Rogers JA
可释放多层的3D细观结构的屈曲驱动组装为独特的应用提供了多样化的设计选项。在先进材料中组装三维(3D)微/纳米结构的能力在广泛的应用领域具有重要意义，几乎涉及到每一类微系统技术。依赖于2D前体的受控压缩屈曲的方法很有前途，因为它们与最复杂的平面技术兼容，其中材料包括无机半导体、聚合物、金属和各种不同种类的组合，长度范围从亚微米到厘米。我们介绍了一套制造技术和设计概念，这些技术和设计概念绕过了与这些方法的原始版本相关的组装过程的基本物理和几何属性设置的某些约束。特别是，可释放的多层2D前体的使用提供了对复杂3D拓扑的访问，包括具有嵌套布局的密集体系结构、受控的纠缠点以及其他以前无法获得的布局。此外，附加结构的同时协调组装可以增强结构的稳定性，并驱动这些系统中扩展特征的运动。由此产生的3D细观结构在一组不同的40多个不同的例子中展示，特征尺寸从微米到厘米，为设备设计提供了独特的可能性。用于近场通信的3D螺旋电感是这样一个例子，与传统2D电感相比，这些想法实现了更高的质量(Q)因数和更宽的工作角度。
Buckling-driven assembly of 3D mesostructures from releasable multilayers offers versatile design options for unique applications. Capabilities for assembly of three-dimensional (3D) micro/nanostructures in advanced materials have important implications across a broad range of application areas, reaching nearly every class of microsystem technology. Approaches that rely on the controlled, compressive buckling of 2D precursors are promising because of their demonstrated compatibility with the most sophisticated planar technologies, where materials include inorganic semiconductors, polymers, metals, and various heterogeneous combinations, spanning length scales from submicrometer to centimeter dimensions. We introduce a set of fabrication techniques and design concepts that bypass certain constraints set by the underlying physics and geometrical properties of the assembly processes associated with the original versions of these methods. In particular, the use of releasable, multilayer 2D precursors provides access to complex 3D topologies, including dense architectures with nested layouts, controlled points of entanglement, and other previously unobtainable layouts. Furthermore, the simultaneous, coordinated assembly of additional structures can enhance the structural stability and drive the motion of extended features in these systems. The resulting 3D mesostructures, demonstrated in a diverse set of more than 40 different examples with feature sizes from micrometers to centimeters, offer unique possibilities in device design. A 3D spiral inductor for near-field communication represents an example where these ideas enable enhanced quality (Q) factors and broader working angles compared to those of conventional 2D counterparts.
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影响因子：
13.3
作者：
Kim, Jeonghyun;Banks, Anthony;Rogers, John A.
通讯作者：
Rogers, John A.
影响因子：
29.4
作者：
Lee, Jae-Hwang;Koh, Cheong Yang;Singer, Jonathan P.;Jeon, Seog-Jin;Maldovan, Martin;Stein, Ori;Thomas, Edwin L.
通讯作者：
Thomas, Edwin L.
影响因子：
5.3
作者：
Li, Huan;Guo, Xiaoying;Hsia, K. Jimmy
通讯作者：
Hsia, K. Jimmy
影响因子：
8.6
作者：
Braun, Paul V.
通讯作者：
Braun, Paul V.
影响因子：
2
作者：
Bishop, David;Pardo, Flavio;Aksyuk, Vladimir
通讯作者：
Aksyuk, Vladimir