Techniques and Considerations in the Microfabrication of Parylene C Microelectromechanical Systems.
Techniques and Considerations in the Microfabrication of Parylene C Microelectromechanical Systems.
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DOI：
10.3390/mi9090422
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发表时间：
2018-08-22
期刊：
影响因子：
3.4
通讯作者：
Meng E
中科院分区：
文献类型：
--
作者：
Ortigoza-Diaz J;Scholten K;Larson C;Cobo A;Hudson T;Yoo J;Baldwin A;Weltman Hirschberg A;Meng E
Parylene C是一种用于构建柔性、生物相容性和耐腐蚀的微机电系统（MEMS）器件的有前途的材料。历史上，聚对二甲苯C由于其强的屏障性能和生物相容性而被用作医疗植入物（例如支架和起搏器）的封装材料。在过去的几十年中，平面微加工工艺对薄膜Parylene C的适应鼓励其用作MEMS和其他微电子器件的绝缘体、结构和衬底材料。然而，Parylene C在微加工和与液体一起使用期间，特别是对于柔性薄膜电子器件，提出了独特的挑战。特别地，聚对二甲苯C的柔性和低热预算需要修改从硅MEMS继承的制造技术，并且聚对二甲苯-聚对二甲苯和聚对二甲苯-金属界面处的不良粘附性导致在潮湿环境中长时间使用下的器件故障。在这里，我们详细讨论了Parylene C固有的承诺和挑战，并介绍了我们在开发薄膜Parylene MEMS器件方面的经验。
Parylene C is a promising material for constructing flexible, biocompatible and corrosion-resistant microelectromechanical systems (MEMS) devices. Historically, Parylene C has been employed as an encapsulation material for medical implants, such as stents and pacemakers, due to its strong barrier properties and biocompatibility. In the past few decades, the adaptation of planar microfabrication processes to thin film Parylene C has encouraged its use as an insulator, structural and substrate material for MEMS and other microelectronic devices. However, Parylene C presents unique challenges during microfabrication and during use with liquids, especially for flexible, thin film electronic devices. In particular, the flexibility and low thermal budget of Parylene C require modification of the fabrication techniques inherited from silicon MEMS, and poor adhesion at Parylene-Parylene and Parylene-metal interfaces causes device failure under prolonged use in wet environments. Here, we discuss in detail the promises and challenges inherent to Parylene C and present our experience in developing thin-film Parylene MEMS devices.
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影响因子：
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作者：
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发表时间：
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期刊：
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