Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector
Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector
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用于 CLIC 顶点检测器的电容耦合混合像素组件
DOI：
10.1016/j.nima.2016.03.072
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发表时间：
2016
影响因子：
1.4
通讯作者：
P. Valerio
中科院分区：
文献类型：
--
作者：
N. Tehrani;S. Arfaoui;M. Benoit;D. Dannheim;K. Dette;D. Hynds;S. Kulis;I. Perić;M. Petrić;S. Redford;E. Sicking;P. Valerio
CLIC多TeV线性e+ e−对撞机的顶点探测器必须具有最小的材料含量和高空间分辨率，并结合精确的时间戳，以科普预期的高光束诱导背景率。正在考虑的选项之一是使用在商业高压CMOS工艺中实现的有源传感器，电容耦合到混合像素ASIC。这样一个组件的原型，使用两个定制设计的芯片（CCPDv 3作为有源传感器粘到CLICpix读出芯片），已在实验室和在电子束测试中的特点在欧洲核子研究中心SPS使用120 GeV/c的正电荷强子。这些表征研究的结果都是针对有源传感器中的单级和双级放大级进行的，其中在− 60 V衬底偏压下实现了大于99%的效率，单次命中分辨率为6.1 μ m。像素交叉耦合的结果也被提出，显示的敏感性，放置精度和平面性的胶层。
The vertex detector at the proposed CLIC multi-TeV linear e+ e− collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. A prototype of such an assembly, using two custom designed chips (CCPDv3 as active sensor glued to a CLICpix readout chip), has been characterised both in the lab and in beam tests at the CERN SPS using 120 GeV/c positively charged hadrons. Results of these characterisation studies are presented both for single and dual amplification stages in the active sensor, where efficiencies of greater than 99% have been achieved at− 60 V substrate bias, with a single hit resolution of 6.1 μ m. Pixel cross-coupling results are also presented, showing the sensitivity to placement precision and planarity of the glue layer.
CLIC 的物理和探测器：CLIC 概念设计报告
DOI：
10.48550/arxiv.1202.5940
发表时间：
2012
期刊：
arXiv e-prints
影响因子：
--
作者：
Linssen Lucie
通讯作者：
Linssen Lucie
用于 ATLAS、CLIC 和 Mu3e 实验的商用 CMOS 技术中的高压像素探测器
DOI：
10.1016/j.nima.2013.05.006
发表时间：
2013
影响因子：
1.4
作者：
I. Perić
通讯作者：
I. Perić