Improving the reliability of a plastic IC package in the reflow soldering process by DOE
Improving the reliability of a plastic IC package in the reflow soldering process by DOE
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美国能源部 (DOE) 提高回流焊接工艺中塑料 IC 封装的可靠性
DOI：
10.1108/09540910510581147
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发表时间：
2005
影响因子：
2
通讯作者：
K. Lee
中科院分区：
文献类型：
--
作者：
G. Kim;K. Lee
目的：优化封装设计，以减少塑料小轮廓J -引线（SOJ）封装中的应力，从而防止红外焊接过程中的断裂。设计/方法/方法-使用有限元（FE）建模，包括带和不带裂纹尖端建模。采用实验设计（DOE）的方法来减少所需的有限元模型数量。研究结果-发现热应力最小化和防止断裂的最佳设计值不同。结果允许设计变量的值，如IC封装的尺寸和材料特性。实际意义-为了减少应力从而防止断裂，应降低环氧成型化合物的杨氏模量和热膨胀系数的值。独创性/价值：该工作使用了应力分析和断裂力学分析以及DOE来确定同时降低热应力的设计值。
Purpose – Optimisation of the package design in order to reduce stresses in a plastic small outline J‐lead (SOJ) package and to thereby prevent fractures during the infrared soldering process.Design/methodology/approach – Finite element (FE) modelling was used, both with and without crack tip‐modelling. A design of experiment (DOE) approach was used to reduce the number of FE models required.Findings – The optimum design values for minimization of thermal stress and the prevention of fracture were found to be different. The results allow the values of design variables such as the dimensions and material properties of the IC package.Practical implications – To reduce the stresses and thereby prevent fracture, the values of the Young's modulus and coefficient of thermal expansion of the epoxy moulding compound should be reduced.Originality/value – The work has used both stress analysis and fracture mechanics analysis along with DOE to identify the design values which simultaneously reduce the thermal stress...
在潮湿/回流敏感性测试下使用各向异性导电粘合膜的倒装芯片分层评估
DOI：
--
发表时间：
2006
期刊：
IEEE Transactions on components and packaging technologies Vol.29,No.3
影响因子：
--
作者：
Torn Ikeda;Won-Keun Kim;Noriyuki Miyazaki
通讯作者：
Noriyuki Miyazaki