Depth profiling of Al diffusion in silicon wafers by laser-induced breakdown spectroscopy

Depth profiling of Al diffusion in silicon wafers by laser-induced breakdown spectroscopy
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利用激光诱导击穿光谱法对硅片中铝扩散进行深度分析

DOI:
10.1039/c3ja50115a
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发表时间:
2013-08
影响因子:
3.4
通讯作者:
季振国
季振国
中科院分区:
化学2区
文献类型:
--
作者:
张峻;胡轩生;席俊华;孔哲;季振国

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用激光诱导击穿光谱(LIBS)研究了不同温度下Al在硅片中的扩散。用磁控溅射方法在硅片上沉积了厚度约为800 nm的Al薄膜,然后在300℃和610℃的空气中进行后退火(或不进行后退火)以获得不同的深度分布。用能谱仪(EDS)和LIBS测量了Al在晶片中的深度分布。由于检测下限较低,EDS几乎不能区分不同样品较深位置的不同铝浓度。LIBS实验是在大气环境中进行的。脉冲注量固定为16J cm−2,平均消融速率为2 0 0 nm/脉冲。LIBS能很好地区分不同扩散样品的深度分布。结果证实,LIBS非常适合于检测硅片中的金属扩散。
Al diffusion in silicon wafers at different temperatures was detected by laser induced breakdown spectroscopy (LIBS) in this work. An Al thin film with a thickness of about 800 nm was deposited on silicon wafers by magnetron sputtering and then post-annealed in air at 300 and 610 °C (or without post-annealing) to achieve different depth profiles. The depth profile of Al in the wafers was measured using energy dispersive spectroscopy (EDS) and LIBS. EDS almost can not distinguish between the different Al concentrations at deeper positions of the different samples due to its low detection limit. The LIBS experiment was performed in an atmospheric environment. The pulse fluence was fixed at 16 J cm−2 to cause an average ablation rate of 200 nm per pulse. LIBS can distinguish between the depth profiles of different diffusion samples very well. The results confirm that LIBS is very well suited for the detection of metal diffusion in silicon wafers.
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