Behaviors of full compositional W/Cu functionally gradient materials exposed to the edge plasma of HT-7 tokamak
Behaviors of full compositional W/Cu functionally gradient materials exposed to the edge plasma of HT-7 tokamak
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全成分W/Cu功能梯度材料暴露于HT-7托卡马克边缘等离子体的行为
DOI：
10.1016/j.jnucmat.2012.12.044
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发表时间：
2013-04
影响因子：
3.1
通讯作者：
R. Ding
中科院分区：
文献类型：
--
作者：
D.H. Zhu;J.L. Chen;Z.J. Zhou;R. Yan;R. Ding
为了研究梯度结构材料在等离子体加载下的行为，采用超高压电阻烧结（RSUHP）方法成功制备了全组分（0%~ 100%）的六层W/Cu梯度功能材料，并将其暴露于HT-7装置的边缘等离子体中。在2- 7 MW/m ~ 2的功率密度下，等离子体加载210次后，在梯度界面拐角处没有发现分离，而脆性钨层则产生宏观裂纹，裂纹可以深入界面，导致界面失效甚至剥落。为了避免W/Cu功能梯度材料在墙体应用中的这些破坏，有必要通过优化初始粉末和烧结参数来改善W层。
To investigate the behaviors of graded structure materials under plasma loading, six-layered W/Cu functionally gradient materials (FGMs) with full compositional distributions (from 0% to 100%) were successfully fabricated by resistance sintering under ultra-high pressure (RSUHP) method and were exposed to the edge plasma of the HT-7 tokamak. After about 210 shots plasma loading with an estimated power density in the range of 2–7MW/m2, there is no detaching found at the graded interface corners where the thermal stress concentration is expected and the fatigue failures often occur initially, however, the brittle W layer develops the macroscopic cracks which can extend deeply into the interface and results in the interface failure or even the exfoliated W layer. To avoid these destructions for W/Cu FGMs during wall application, it is necessary to ameliorate the W layer by optimizing the initial powders and sintering parameters.
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影响因子：
1.7
作者：
G. Vieider;M. Merola;F. Anselmi;J. Bonal;P. Chappuis;G. Dell’Orco;D. Duglué;R. Duwe;S. Erskine;F. Escourbiac;M. Febvre;L. Giancarli;M. Grattarola;G. Lemarois;H. Pacher;A. Pizzuto;L. Plöchl;B. Riccardi;M. Rödig;J. Schlosser;A. Salito;B. Schedler;C. Wu
通讯作者：
G. Vieider;M. Merola;F. Anselmi;J. Bonal;P. Chappuis;G. Dell’Orco;D. Duglué;R. Duwe;S. Erskine;F. Escourbiac;M. Febvre;L. Giancarli;M. Grattarola;G. Lemarois;H. Pacher;A. Pizzuto;L. Plöchl;B. Riccardi;M. Rödig;J. Schlosser;A. Salito;B. Schedler;C. Wu
DOI：
10.1016/j.fusengdes.2008.12.069
发表时间：
2009-06
期刊：
--
影响因子：
--
作者：
A. Raffray;S. Malang;X. Wang
通讯作者：
A. Raffray;S. Malang;X. Wang
影响因子：
3.1
作者：
Y. Shimomura
通讯作者：
Y. Shimomura
影响因子：
3.1
作者：
J. Park;Y. Jung;Byung-Kwon Choi;Jung-Suk Lee;Y. Jeong;B. Hong
通讯作者：
J. Park;Y. Jung;Byung-Kwon Choi;Jung-Suk Lee;Y. Jeong;B. Hong
影响因子：
3.1
作者：
S. Miyashiro;S. Fujita;T. Okita
通讯作者：
S. Miyashiro;S. Fujita;T. Okita