Determining solid/liquid interfacial energies in Al-Cu by curvature controlled melting point depression

Determining solid/liquid interfacial energies in Al-Cu by curvature controlled melting point depression
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通过曲率控制熔点降低测定 Al-Cu 中的固/液界面能

DOI:
10.1016/j.actamat.2018.01.012
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发表时间:
2018
期刊:
影响因子:
9.4
通讯作者:
Rettenmayr M.
Rettenmayr M.
中科院分区:
材料科学1区
文献类型:
--
作者:
Lippmann S;Simon C;Zechel S;Seyring M;Schubert U;Wilde G;Rettenmayr M.

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本文介绍了一种测定合金固/液界面能的实验方法。在温度梯度下,通过短时退火(t < 10 s),在4wt%Cu/Al的均匀固溶体中生成了直径小于50 nm的球形Al 2Cu金属间化合物颗粒,形成“离异共晶”。在将样品的代表性部分的Al基质溶解在无水丁醇中之后,使用透射电子显微镜(TEM)分析粒度分布。在高灵敏度的功率补偿差示扫描量热计中加热剩余的样品部分期间,测量共晶熔化的开始。窄尺寸分布的期望值和各自的曲率过冷度的Gibbs-Thomson方程的基础上关联。为了推导出固/液界面能,在固/液界面处使用CALPHAD型数据库的热力学平衡的假设下计算温度和浓度依赖的熔融熵。在热力学平衡中,在恒定温度下,固体和液体相在界面处具有不同的浓度,导致界面能高于来自最大过冷实验的纯Al的值,并且低于使用晶界凹槽法确定的Al-Cu的值。讨论了该方法在其它合金体系中的推广应用。
An experimental method for determining solid/liquid interfacial energies of alloys is presented. Spherical intermetallic particles of Al2Cu with diameters down to 50 nm were generated as ”divorced eutectic” in an initially homogeneous solid solution of 4 wt% Cu in Al by short-term annealing (t < 10 s) in a temperature gradient. Particle size distributions were analyzed using transmission electron microscopy (TEM) after dissolving the Al matrix of a representative part of the sample in dry butanol. During heating of the remaining sample part in a highly sensitive power-compensating differential scanning calorimeter, the onset of eutectic melting was measured. The expectation value of the narrow size distributions and the respective curvature undercooling were correlated on the basis of the Gibbs-Thomson equation. For deriving the solid/liquid interfacial energy, the temperature and concentration dependent melting entropy were calculated under the assumption of thermodynamic equilibrium at the solid/liquid interface using a CALPHAD type database. In thermodynamic equilibrium, at a constant temperature the solid and the liquid phase have different concentrations at the interface leading to an interfacial energy that is higher than the value for pure Al derived from maximum supercooling experiments, and lower than the value for Al-Cu determined using the grain boundary groove method. The extension of the method to other alloy systems is discussed.
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