Densification and grain growth of CuO-doped Pr6O11 varistors

Densification and grain growth of CuO-doped Pr6O11 varistors
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CuO 掺杂 Pr6O11 压敏电阻的致密化和晶粒生长

DOI:
10.1016/j.ceramint.2010.02.028
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发表时间:
2010-07
影响因子:
5.2
通讯作者:
Hua, Z. Q.
Hua, Z. Q.
中科院分区:
材料科学1区
文献类型:
--
作者:
Zhao, H. W.;Dong, L.;Wang, Y.;Li, T. Y.;Wang, H. Q.;Hua, Z. Q.

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研究了CuO掺杂对Pr 6 O 11压敏电阻器微观结构和电性能的影响。通过常规陶瓷技术制备样品,并在空气中在1150°C下烧结2小时。用扫描电子显微镜(SEM)观察其微观结构。利用X射线衍射仪(XRD)和能谱仪(EDS)对产物的物相和化学成分进行了分析。结果表明,CuO的加入可使Pr 6 O 11压敏电阻的致密度提高到理论致密度的95.8%。CuO与Pr 6 O 11形成固溶体,当Pr 6 O 11含量达到0.5mol%时,Pr 2CuO 4在晶界析出。从I-V测量结果来看,少量CuO掺杂可以改善非线性电学性能。CuO含量的进一步增加导致非线性电性能的降低,这是由于晶粒表面上吸收的氧的消耗。
The effect of CuO doping on the microstructure and electrical properties of Pr6O11varistors was investigated. Samples were prepared by conventional ceramic techniques, and were sintered at 1150°C in air for 2h. The microstructure was investigated by scanning electron microscopy (SEM). The phases and chemical composition were analyzed by X-ray diffraction (XRD) and energy dispersive spectroscopy (EDS). The results indicated that CuO can promote the densification of the Pr6O11-based varistors to 95.8% of the theoretical density. CuO forms a solid solution with Pr6O11up to 0.5mol%, above which Pr2CuO4precipitates in the grain boundary. From the I–V measurements, minor CuO doping can improve the nonlinear electrical properties. A further increase in CuO content induces a reduction in the nonlinear electrical properties due to the consumption of absorbed oxygen on the grain surfaces.
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