Neurons on Parafilm: Versatile elastic substrates for neuronal cell cultures

Neurons on Parafilm: Versatile elastic substrates for neuronal cell cultures
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封口膜上的神经元:用于神经元细胞培养的多功能弹性基质

DOI:
10.1016/j.jneumeth.2011.10.023
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发表时间:
2012
影响因子:
3
通讯作者:
Y. Nam
Y. Nam
中科院分区:
医学4区
文献类型:
--
作者:
Sangjin Yoo;Y. Nam

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多种材料已应用于神经元细胞培养基质,以提高培养效率并提供相关的细胞生长环境。在这里,我们报告了 Parafilm®M(“Parafilm”)作为神经元培养和图案化的新型基质的应用。细胞培养结果表明,弹性封口膜对细胞活力、神经突长度和数量以及体细胞扩散有影响。封口膜也是使用传统微缩印刷(μCP)技术获得图案化神经元培养物的有效基材。线状或网格形式的聚赖氨酸微图案很容易从PDMS印模转移到裸露的封口膜表面,并且空间受限的神经元培养物成功维持了三周以上。我们还证明,可以使用一块封口膜轻松制造批量处理细胞培养基质。柔软性、可塑性和疏水性是 Parafilm 被视为实用细胞培养平台的主要特征。研究结果可以扩展到在组织工程和生物芯片应用中开发廉价且实用的神经元培养基质。
A variety of materials has been applied to neuronal cell culture substrates to improve the efficiency of the culture and to provide pertinent cell growth environment. Here we report the application of Parafilm®M (‘Parafilm’) as a novel substrate for neuronal culture and patterning. Cell culture results show that elastic Parafilm had effects on cell viability, length and number of neurites, and soma spreading. Parafilm was also an effective substrate to obtain patterned neuronal cultures using a conventional micro-contract printing (μCP) technique. Polylysine micropatterns in line or grid forms were readily transferred from PDMS stamp to bare Parafilm surfaces and spatially confined neuronal cultures were successfully maintained for over three weeks. We also demonstrate that batch-processing cell culture substrates can be easily fabricated using a piece of Parafilm. The softness, plasticity, and hydrophobicity were main features that made it attractive for Parafilm to be considered as a practical cell culture platform. The results can be extended to develop an inexpensive and practical neuronal culture substrates in tissue engineering and biochip applications.
DOI: 10.1016/s0142-9612(00)00343-4
发表时间: 2001-05-01
期刊: BIOMATERIALS
影响因子: 14
作者:
Branch, DW;Wheeler, BC;Leckband, DE
通讯作者: Leckband, DE
DOI: 10.1021/nl035193d
发表时间: 2004-03-01
期刊: NANO LETTERS
影响因子: 10.8
作者:
Hu, H;Ni, YC;Parpura, V
通讯作者: Parpura, V