Experimental and Numerical Investigations of a Novel Laser Impact Liquid Flexible Microforming Process
Experimental and Numerical Investigations of a Novel Laser Impact Liquid Flexible Microforming Process
复制标题
新型激光冲击液体柔性微成型工艺的实验和数值研究
DOI：
10.3390/met8080599
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发表时间：
2018-07
期刊：
影响因子：
2.9
通讯作者：
Xiao Wang
中科院分区：
文献类型：
--
作者：
Fei Liu;Huixia Liu;Chenkun Jiang;Youjuan Ma;Xiao Wang
针对激光直接冲击微压印技术的一些缺陷，提出了一种以激光冲击波为能量源，液体为传力介质的高应变率微压印技术--激光冲击液体柔性压印（LILFE）技术。通过实验和数值模拟，研究了激光能量和工件厚度对LILFE工艺纯铜箔变形特性的影响。建立了有限元模型，以进一步了解典型的变形阶段，数值模拟的结果与实验结果是一致的。实验和数值模拟结果表明，随着激光能量的增加和工件厚度的减小，压凸件的成形精度和深度都有所提高。随着工件厚度的减小，压凸件的厚度减薄率增大，最大减薄发生在转角处。实验结果还表明，LILFE工艺可以保护工件表面不被烧蚀和损坏，可以保证成形零件的表面质量。此外，数值模拟研究揭示了不同激光能量下压印微特征的塑性应变分布。
A novel high strain rate microforming technique, laser impact liquid flexible embossing (LILFE), which uses laser induced shock waves as an energy source, and liquid as a force transmission medium, is proposed by this paper in order to emboss three-dimensional large area micro arrays on metallic foils and to overcome some of the defects of laser direct shock microembossing technology. The influences of laser energy and workpiece thickness on the deformation characteristics of the pure copper foils with the LILFE process were investigated through experiments and numerical simulation. A finite element model was built to further understand the typical stages of deformation, and the results of the numerical simulation are consistent with those achieved from the experiments. The experimental and simulation results show that the forming accuracy and depth of the embossed parts increases with the increase in laser energy and decrease in workpiece thickness. The thickness thinning rate of the embossed parts increases with the decrease of the workpiece thickness, and the severest thickness thinning occurs at the bar corner region. The experimental results also show that the LILFE process can protect the workpiece surface from being ablated and damaged, and can ensure the surface quality of the formed parts. Besides, the numerical simulation studies reveal the plastic strain distribution of embossed microfeatures under different laser energy.
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DOI：
10.1016/j.jcp.2016.07.001
发表时间：
2016-10
期刊：
J. Comput. Phys.
影响因子：
--
作者：
A. Barlow;P. Maire;W. Rider;R. Rieben;M. Shashkov
通讯作者：
A. Barlow;P. Maire;W. Rider;R. Rieben;M. Shashkov
DOI：
10.1016/s0168-583x(03)00632-3
发表时间：
2003-08
影响因子：
1.3
作者：
Y. Hirata
通讯作者：
Y. Hirata
影响因子：
6.3
作者：
Zhang Rui;Zhang Tie-sheng
通讯作者：
Zhang Rui;Zhang Tie-sheng
影响因子：
4.1
作者：
P. Kjellgren;J. Hyvärinen
通讯作者：
P. Kjellgren;J. Hyvärinen
影响因子：
1.6
作者：
Fenqiang Li;Jun Zhao;J. Mo;Jianjun Li;Liang Huang
通讯作者：
Fenqiang Li;Jun Zhao;J. Mo;Jianjun Li;Liang Huang