Steep switching in trimmed-gate tunnel FET
Steep switching in trimmed-gate tunnel FET
复制标题
修整栅极隧道 FET 中的陡峭开关
DOI:
10.1063/1.5043570
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发表时间:
2018
期刊:
影响因子:
1.6
通讯作者:
K. Fukuda
中科院分区:
文献类型:
--
作者:
H. Asai;T. Mori;T. Matsukawa;J. Hattori;K. Endo;K. Fukuda
We propose a tunnel field-effect transistor (TFET) having a trimmed gate (TG) structure, which considerably improves the subthreshold swing (SS). The TG structure truncates the needless long band-to-band tunneling (BTBT) paths to a “channel”, which normally appear in a conventional TFET, and realize a sudden switching to the on-state arising from a short BTBT path. Our simulations demonstrate that the TG-TFET can achieve an extremely steep SS, less than 10 mV/decade, in the double-gated Si-channel configuration. The TG structure also improves the ratio ION/IOFF to a value higher than that of ideal MOSFETs in the operation voltage range up to 0.35 V. The mechanism of steep switching is based on a simple modification of the gate electrostatic control; therefore, in addition to the demonstrated TFETs, the TG structure is universally applicable to many types of TFETs.We propose a tunnel field-effect transistor (TFET) having a trimmed gate (TG) structure, which considerably improves the subthreshold swing (SS). The TG structure truncates the needless long band-to-band tunneling (BTBT) paths to a “channel”, which normally appear in a conventional TFET, and realize a sudden switching to the on-state arising from a short BTBT path. Our simulations demonstrate that the TG-TFET can achieve an extremely steep SS, less than 10 mV/decade, in the double-gated Si-channel configuration. The TG structure also improves the ratio ION/IOFF to a value higher than that of ideal MOSFETs in the operation voltage range up to 0.35 V. The mechanism of steep switching is based on a simple modification of the gate electrostatic control; therefore, in addition to the demonstrated TFETs, the TG structure is universally applicable to many types of TFETs.
DOI:
10.1016/j.mssp.2016.11.031
发表时间:
2017
期刊:
Mater. Sci. Semicond. Processing
影响因子:
--
作者:
S.Iizuka;Y.Asayama;T.Nakayama
通讯作者:
T.Nakayama