High thermal shock resistance realized by Ti/TiH2 doped tungsten-potassium alloys
High thermal shock resistance realized by Ti/TiH2 doped tungsten-potassium alloys
复制标题
Ti/TiH2 掺杂钨钾合金实现高抗热震性
DOI：
10.1016/j.jallcom.2018.11.389
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发表时间：
2019-04
影响因子：
6.2
通讯作者：
Jun Tang
中科院分区：
文献类型：
--
作者：
Longqing Chen;Bo Huang;Xiaoliang Yang;Youyun Lian;Xiang Liu;Jun Tang
Tungsten-potassium-titanium (W-K-Ti) alloys were fabricated by spark-plasma-sintering (SPS) and traditional rotary swaging (RS) techniques. Doping conditions and sintering methods were compared on the relative density, microstructure, hardness, recrystallization temperature, and the thermal shock resistance properties. Transient heat loads under 0.37 GW m−2were applied on the W-K-Ti samples at room temperature for different cycles and pulsed durations. It was found that moderate Ti-doping (0.05 and 0.075 wt%) in W-K alloys can enhance the thermal shock resistance. Low-cycle thermal fatigue test suggested better thermal shock resistance in SPS-sintered W-K-Ti alloy (SPS-W-K-Ti) using TiH2dopant. The main reason was that the decomposition of TiH2significantly reduced the oxygen content of the ingots, which improved the ductility and thermal shock resistance of tungsten alloys. Further fracture analyses indicated that Ti-doping through TiH2formed intra- and inter- Ti-rich voids in TiH2-doped W-K alloy, while only intergranular Ti particles were found lying along grain boundaries in the Ti-doped one. The formation mechanism of the Ti-rich voids was investigated in detail. This work provides a potential route for obtaining plasma facing materials with high thermal shock resistance.
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影响因子：
3.1
作者：
G. Sinclair;S. Gonderman;J. Tripathi;A. Hassanein
通讯作者：
G. Sinclair;S. Gonderman;J. Tripathi;A. Hassanein
影响因子：
64.8
作者：
D. Tabor
通讯作者：
D. Tabor
锆钨微合金化的放电等离子烧结及其力学性能
影响因子：
3.1
作者：
Xie, Z. M.;Liu, R.;Liu, C. S.
通讯作者：
Liu, C. S.
影响因子：
6.2
作者：
Ye Xiao;Bo Huang;Bo He;Ke Shi;Y. Lian;Xiang Liu;Jun Tang
通讯作者：
Ye Xiao;Bo Huang;Bo He;Ke Shi;Y. Lian;Xiang Liu;Jun Tang
DOI：
10.1038/scientificamerican01191918-40csupp
发表时间：
1936
期刊：
--
影响因子：
--
作者：
F. C. Lea
通讯作者：
F. C. Lea