SAP domain forms a flexible part of DNA aperture in Ku70/80.

SAP domain forms a flexible part of DNA aperture in Ku70/80.
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DOI:
10.1111/febs.15732
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发表时间:
2021-07
期刊:
The FEBS journal
影响因子:
--
通讯作者:
Blundell TL
Blundell TL
中科院分区:
其他
文献类型:
--
作者:
Hnízda A;Tesina P;Nguyen TB;Kukačka Z;Kater L;Chaplin AK;Beckmann R;Ascher DB;Novák P;Blundell TL

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非同源末端连接 (NHEJ) 是一种 DNA 修复机制,可重新连接双链 DNA 断裂,以在整个细胞周期中保持基因组完整性。 Ku70/80 复合体可识别 DNA 断裂,并作为 NHEJ 成分招募的重要枢纽。在这里,我们描述了 Ku70 C 末端结构域(称为 SAP 结构域)的分子内相互作用。使用单颗粒冷冻电子显微镜、分子间交联的质谱分析和分子建模模拟,我们捕获了 SAP 结构域根据 DNA 结合的可变位置。第一个位置位于 Ku70/80 apo 形式的 DNA 孔径处,但在 DNA 结合状态下未观察到。第二个位置在 DNA 孔径下方,靠近 Ku70 的螺旋臂,在 apo 和 DNA 结合状态下均观察到。 SAP 结构域在 DNA 孔径中的定位表明其具有作为断裂 DNA 的灵活入口门的功能。 EM 地图已存入 EMDB (EMD-11933)。坐标已存入蛋白质数据库(PDB 7AXZ)。其他数据可根据要求从相应作者处获得。 Ku70/80 介导 DNA 断裂识别以启动非同源末端连接,这是维持基因组完整性的重要 DNA 修复机制。我们的研究描述了 SAP 结构域(Ku70 亚基中的 C 端结构域)根据 DNA 结合的动态运动。使用冷冻电镜、质谱和计算模型,SAP 结构域位于 DNA 孔径处,可能形成断裂 DNA 的灵活入口。
Nonhomologous end joining (NHEJ) is a DNA repair mechanism that religates double‐strand DNA breaks to maintain genomic integrity during the entire cell cycle. The Ku70/80 complex recognizes DNA breaks and serves as an essential hub for recruitment of NHEJ components. Here, we describe intramolecular interactions of the Ku70 C‐terminal domain, known as the SAP domain. Using single‐particle cryo‐electron microscopy, mass spectrometric analysis of intermolecular cross‐linking and molecular modelling simulations, we captured variable positions of the SAP domain depending on DNA binding. The first position was localized at the DNA aperture in the Ku70/80 apo form but was not observed in the DNA‐bound state. The second position, which was observed in both apo and DNA‐bound states, was found below the DNA aperture, close to the helical arm of Ku70. The localization of the SAP domain in the DNA aperture suggests a function as a flexible entry gate for broken DNA. EM maps have been deposited in EMDB (EMD‐11933). Coordinates have been deposited in Protein Data Bank (PDB 7AXZ). Other data are available from corresponding authors upon a request. Ku70/80 mediates a recognition of DNA breaks to initiate nonhomologous end joining, an important DNA repair mechanism for maintaining genomic integrity. Our study describes dynamic movements of the SAP domain, a C‐terminal domain in the Ku70 subunit, depending on DNA binding. Using cryo‐EM, mass spectrometry and computational modelling, the SAP domain was localized at the DNA aperture and probably forms a flexible entry gate for broken DNA.
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