Photocatalytic removal of cefazolin using Ag3PO4/BiOBr under visible light and optimization of parameters by response surface methodology
Photocatalytic removal of cefazolin using Ag3PO4/BiOBr under visible light and optimization of parameters by response surface methodology
复制标题
可见光下 Ag3PO4/BiOBr 光催化去除头孢唑啉并通过响应面法优化参数
DOI：
10.1016/j.jiec.2016.09.032
复制
发表时间：
2017-01
影响因子：
6.1
通讯作者：
Yingping Huang
中科院分区：
文献类型：
--
作者：
Yuhui Xiao;Xianghua Song;Zhuo Liu;Ruiping Li;Xiaorong Zhao;Yingping Huang
研究了Ag3PO4/BiOBr复合材料在可见光照射下对头孢唑啉（CFZ）的降解。采用Box-Behnken试验设计结合响应面分析法研究了催化剂投加量、pH、CFZ初始浓度和降解时间对CFZ去除率的影响及其交互作用。pH值是最有影响的因素，h+和dotOH自由基都在光催化过程中起作用。高相关系数（R2 = 0.9986和调整的R2 = 0.9973）表明预测值和实验值之间的密切配合。Ag_3PO_4/BiOBr复合材料对CFZ的去除效果显著，是一种很有前途的CFZ废水处理技术。
The degradation of cefazolin (CFZ) by Ag3PO4/BiOBr composites under visible-light irradiation was explored. The main and interaction of parameters (catalyst dosage, pH, CFZ initial concentration and degradation time) on removal of CFZ were studied by Box–Behnken design combined with response surface methodology. The pH was the most influential factor and both h+and radical dotOH played a role in the photocatalytic process. The high correlation coefficients (R2= 0.9986 and adjusted R2= 0.9973) demonstrated close fit between the predicted and experimental values. The exceptional efficiency of Ag3PO4/BiOBr composite in removing CFZ represents a promising technique for treatment of CFZ-containing wastewater.
登录
查看更多内容
影响因子：
8.8
作者：
D. Fabbri;M. Minella;V. Maurino;C. Minero;D. Vione
通讯作者：
D. Fabbri;M. Minella;V. Maurino;C. Minero;D. Vione
影响因子：
--
作者：
Wang Kai;Wang Kai;Xu Juan;Xia Hua;Na Li;Mindong Chen;F. Teng;Yongfa Zhu;W. Yao
通讯作者：
Wang Kai;Wang Kai;Xu Juan;Xia Hua;Na Li;Mindong Chen;F. Teng;Yongfa Zhu;W. Yao
斑马鱼胚胎毒性试验研究头孢菌素的毒性功能基团
DOI：
10.1002/ardp.201000005
发表时间：
2010-10
期刊：
Arch. Pharm. Chem. Life Sci.
影响因子：
--
作者：
张靖溥
通讯作者：
张靖溥
影响因子：
6.9
作者：
Manke Jia;Xiaolong Hu;Shulian Wang;Yingping Huang;Lirong Song
通讯作者：
Manke Jia;Xiaolong Hu;Shulian Wang;Yingping Huang;Lirong Song
影响因子：
12.8
作者：
Gulkowska, A.;Leung, H. W.;Lam, Paul K. S.
通讯作者：
Lam, Paul K. S.