Impact of solvent selection and temperature on porosity and resistance of printed self‐reducing silver inks
Impact of solvent selection and temperature on porosity and resistance of printed self‐reducing silver inks
复制标题
溶剂选择和温度对印刷自还原银油墨孔隙率和电阻的影响
DOI：
10.1002/pssa.201600150
复制
发表时间：
2016
期刊：
影响因子：
--
通讯作者：
O. Hildreth
中科院分区：
文献类型：
--
作者：
Christopher S. Lefky;Avinash Mamidanna;Yiwen Huang;O. Hildreth
活性金属油墨有潜力取代颗粒基油墨用于印刷金属和电极。自还原银油墨的最新进展已将还原温度从180°C降至室温。然而，大多数活性油墨是在室温下印刷并在高温下烧结以获得良好的电阻率。在这项工作中，我们证明了通过调整溶剂选择和在稍微升高的温度下印刷可以实现低电阻率（1.8 μΩcm）。这项工作考察了溶剂类型和衬底温度对用自还原银二胺油墨印刷的银薄膜的形貌和电性能的影响。我们表明，可以控制形貌、孔隙率和介质电阻率，从而在不烧结的情况下产生致密薄膜。孔隙度从93%降低到50%，介质电阻率从180 μΩcm降低到1.8 μΩcm。在66°C下印刷的10:1 - EtOH:Ag油墨的介质电阻率最低。总的来说，该工艺表明，高导电性银膜可以在低温下印刷，对形态有广泛的控制，而且不需要印刷后退火。
Reactive metal inks have the potential to replace particle‐based inks for printed metals and electrodes. Recent advances in self‐reducing silver inks have dropped the reduction temperature from >180 °C down to room temperature. However, most reactive inks are printed at room temperature and sintered at an elevated temperature to achieve good electrical resistivity. In this work, we demonstrate that low electrical resistivity (1.8 μΩcm) can be achieved by adjusting solvent selection and printing at slightly elevated temperatures. This work examines the impact of solvent type and substrate temperature on the resulting morphology and electrical properties of silver films printed with a self‐reducing silver‐diamine ink. We show that morphology, porosity, and media resistivity can be controlled to produce a dense film without sintering. The porosity was adjusted from 93% down to 50% and the media resistivity two orders of magnitude from 180 μΩcm down to 1.8 μΩcm. The lowest media resistivity was found for a 10:1‐EtOH:Ag ink printed at 66 °C. Overall, this process demonstrates that highly conductive silver films can be printed at low temperatures with broad control over morphology and without post‐print annealing.
影响因子：
8.6
作者：
Jahn, Stephan F.;Blaudeck, Thomas;Schmidt, Peer
通讯作者：
Schmidt, Peer