Soft areal tactile sensors with embedded semiconductor pressure sensors in a structured elastic body

Soft areal tactile sensors with embedded semiconductor pressure sensors in a structured elastic body
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在结构化弹性体中嵌入半导体压力传感器的软区域触觉传感器

DOI:
10.1109/icsens.2004.1426477
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发表时间:
2004
期刊:
Proceedings of IEEE Sensors, 2004.
影响因子:
--
通讯作者:
T. Mukai
T. Mukai
中科院分区:
--
文献类型:
--
作者:
T. Mukai

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人类共生机器人,如护理机器人,共享人类环境并与人类互动,应该覆盖柔软的触觉传感器,以确保安全和灵巧的操作。不幸的是,我们没有明确和标准的触觉传感器用于此目的。为了解决这个问题,我们正在开发将半导体压力传感器作为压力传感元件嵌入弹性体的触觉传感器。我们已经建立了一种使用柔性衬底在弹性体中嵌入半导体压力传感器阵列的方法。为了提高灵敏度,我们还提出了一种由硬弹性材料和软弹性材料组成的弹性体结构。我们首先描述了我们的软面触觉传感器的结构,用于检测正应力。然后我们报告了他们的模拟和实验结果。最后,我们描述了该传感器用于检测剪切应力的扩展。
Human symbiotic robots, such as for nursing, which share humans' environments and interact with them, should be covered with soft areal tactile sensors for safety and dexterous manipulation. Unfortunately, we do not have definitive and standard tactile sensors for this purpose. In order to solve this problem, we are now developing tactile sensors by embedding semiconductor pressure sensors, as pressure-sensing elements, into an elastic body. We have established a method of embedding an array of semiconductor pressure sensors in an elastic body using a flexible substrate. We have also proposed a structure for the elastic body consisting of hard and soft elastic materials, for improving sensitivity. We first describe the structure of our soft areal tactile sensors, for detecting normal stress. Then we report results of their simulations and experiments. Finally we describe the extension of our sensor for detecting shearing stress.
DOI: 10.1109/robot.2002.1014810
发表时间: 2002-05
期刊: Proceedings 2002 IEEE International Conference on Robotics and Automation (Cat. No.02CH37292)
影响因子: --
作者:
T. Kanda;H. Ishiguro;T. Ono;M. Imai;R. Nakatsu
通讯作者: T. Kanda;H. Ishiguro;T. Ono;M. Imai;R. Nakatsu