Periodic cracking of films supported on compliant substrates.
Periodic cracking of films supported on compliant substrates.
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DOI：
10.1016/j.jmps.2011.04.009
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发表时间：
2011-09
影响因子：
5.3
通讯作者：
Takayama S
中科院分区：
文献类型：
--
作者：
Thouless MD;Li Z;Douville NJ;Takayama S
当将拉伸应变施加到支撑在顺应性衬底上的膜时，平行裂纹的图案可以穿过膜和衬底两者。一个线弹性断裂力学模型的现象，提出了扩展早期的分析，其中裂纹仅限于膜。它示出了如何失败的基板减少所需的临界应变开始断裂的膜。这种效应对于相对坚韧的膜更明显。然而，有一个临界比率的膜基板的韧性以上，稳定的裂纹不响应于所施加的负载形成。相反，基底的灾难性失效与单通道裂纹的传播同时发生。这一临界韧性比的增加与膜和基板之间的模量失配，使周期性的裂纹图案更有可能被观察到与相对较硬的膜。在模量失配值相对较低的情况下，甚至比基材更脆的膜也可能导致基材的灾难性失效。低于临界韧性比，有一个政权，其中稳定的裂纹阵列可以在膜和基板中形成。随着应变的增加，这些阵列的深度增加，而间距减小。最终，裂纹阵列可以变得足够深以导致基板失效。
When a tensile strain is applied to a film supported on a compliant substrate, a pattern of parallel cracks can channel through both the film and substrate. A linear-elastic fracture-mechanics model for the phenomenon is presented to extend earlier analyses in which cracking was limited to the film. It is shown how failure of the substrate reduces the critical strain required to initiate fracture of the film. This effect is more pronounced for relatively tough films. However, there is a critical ratio of the film to substrate toughness above which stable cracks do not form in response to an applied load. Instead, catastrophic failure of the substrate occurs simultaneously with the propagation of a single channel crack. This critical toughness ratio increases with the modulus mismatch between the film and substrate, so that periodic crack patterns are more likely to be observed with relatively stiff films. With relatively low values of modulus mismatch, even a film that is more brittle than the substrate can cause catastrophic failure of the substrate. Below the critical toughness ratio, there is a regime in which stable crack arrays can be formed in the film and substrate. The depth of these arrays increases, while the spacing decreases, as the strain is increased. Eventually, the crack array can become deep enough to cause substrate failure.
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DOI：
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发表时间：
2010-04-01
影响因子：
2.8
作者：
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影响因子：
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发表时间：
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期刊：
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影响因子：
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作者：
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影响因子：
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