Temperature dependence of electrical and thermal conduction in single silver nanowire.
Temperature dependence of electrical and thermal conduction in single silver nanowire.
复制标题
DOI：
10.1038/srep10718
复制
发表时间：
2015-06-02
影响因子：
4.6
通讯作者：
Wang X
中科院分区：
文献类型：
--
作者：
Cheng Z;Liu L;Xu S;Lu M;Wang X
在这项工作中，在一个单独的银纳米线的热和电输运的特征在于下降到35 K的强结构缺陷诱导的电子散射的深入理解。结果表明，在室温下，电阻率增加约4倍，从体银。发现银纳米线的德拜温度（151 K）比块体银的德拜温度（235 K）低36%，证实了强的声子软化。在室温下，热导率从体银的热导率降低了55%。随着温度的下降，这种减少变得更大。为了解释银纳米线和块体银的热导率（κ）~温度（T）的相反趋势，使用统一的热阻率（）来阐明电子散射机制。对于银纳米线观察到大的残余Θ，而块体银的残余θ几乎为零。相同的~T趋势表明，银纳米线和块状银具有相似的声子-电子散射热输运机制。由于声子辅助的电子能量在晶界上的转移，发现银纳米线的洛伦兹数远大于体银的洛伦兹数，并且随着温度的降低而减小。
In this work, the thermal and electrical transport in an individual silver nanowire is characterized down to 35 K for in-depth understanding of the strong structural defect induced electron scattering. The results indicate that, at room temperature, the electrical resistivity increases by around 4 folds from that of bulk silver. The Debye temperature (151 K) of the silver nanowire is found 36% lower than that (235 K) of bulk silver, confirming strong phonon softening. At room temperature, the thermal conductivity is reduced by 55% from that of bulk silver. This reduction becomes larger as the temperature goes down. To explain the opposite trends of thermal conductivity (κ) ~ temperature (T) of silver nanowire and bulk silver, a unified thermal resistivity () is used to elucidate the electron scattering mechanism. A large residual Θ is observed for silver nanowire while that of the bulk silver is almost zero. The same ~T trend proposes that the silver nanowire and bulk silver share the similar phonon-electron scattering mechanism for thermal transport. Due to phonon-assisted electron energy transfer across grain boundaries, the Lorenz number of the silver nanowire is found much larger than that of bulk silver and decreases with decreasing temperature.
登录
查看更多内容
影响因子：
3.7
作者：
Bayle, M.;Benzo, P.;Carles, R.
通讯作者：
Carles, R.
影响因子：
3.2
作者：
Cheng, Zhe;Xu, Zaoli;Wang, Xinwei
通讯作者：
Wang, Xinwei
影响因子：
4
作者：
Ou, M. N.;Yang, T. J.;Lai, S. J.
通讯作者：
Lai, S. J.
DOI：
10.6028/jres.100.012
发表时间：
1995-03
影响因子：
1.5
作者：
Smith DR;Fickett FR
通讯作者：
Fickett FR
影响因子：
3.7
作者：
Kästle, G;Boyen, HG;Ziemann, P
通讯作者：
Ziemann, P