Analysis and Implementation of Self-Packaged Multi-Layer Suspended Coplanar Waveguide and its Applications in Filtering Circuits
Analysis and Implementation of Self-Packaged Multi-Layer Suspended Coplanar Waveguide and its Applications in Filtering Circuits
复制标题
自封装多层悬挂共面波导的分析与实现及其在滤波电路中的应用
DOI：
10.1109/access.2021.3138764
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发表时间：
2022
期刊：
影响因子：
3.9
通讯作者：
Jun Pu
中科院分区：
文献类型：
--
作者：
Jian-Kang Xiao;Jiao Zhang;Jun Pu
本文利用保角映射方法对理想悬浮共面波导模型进行了分析，推导出了特性阻抗公式并进行了验证。提出并实现了一种采用多层PCB技术的自封装悬置共面波导（SCPW），在DC ~ 10 GHz频率范围内，实验插入损耗小于0.5dB，回波损耗优于15.8dB，克服了传统悬置电路由于需要金属腔和机械装配而造成的体积大、重量重、难以集成等缺点。采用自封装和内/外端连接两种方式来减小波泄漏。基于自封装多层悬置共面波导，实现了一种高频率选择性、高隔离度的多谐振器耦合双工器，实测隔离度不低于42.5dB，带外抑制大于37 dB，并具有多个传输零点。一个无反射带阻滤波器的测量S11衰减超过13.8dB的也被实现，证明了自封装的多层SCPW的可用性。
In this paper, ideal suspended coplanar waveguide model is analyzed by using conformal mapping method, and the characteristic impedance is formulated and verified. A self-packaged suspended coplanar waveguide (SCPW) using multi-layer PCB technique is proposed and implemented with a experimental insertion loss of no more than 0.5dB, and return loss of better than 15.8dB from DC to 10GHz, which eliminates the drawbacks of the traditional suspended circuits such as bulky size, heavy weight and difficult to be integration because of their indispensable metal cavity and mechanical assemble. Both self-packaging and inside/outside end connection are used to reduce the wave leakage. Based on the self-packaged multi-layer suspended coplanar waveguide, a high frequency selective and high isolated multi-resonator coupled diplexer with measured isolation of no less than 42.5dB, and out-of-band suppression of more than 37dB as well as multiple transmission zeros have been implemented. A reflectionless bandstop filter with a measured S11 attenuation of more than 13.8dB is also implemented for demonstrating the availability of the self-packaged multi-layer SCPW.
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DOI：
10.23919/eumc.2012.6459304
发表时间：
2012-10
期刊：
2012 7th European Microwave Integrated Circuit Conference
影响因子：
--
作者：
I. Kang;Young-Gon Kim;Dong-Sik Woo;Sung-Kyun Kim;K. Kim
通讯作者：
I. Kang;Young-Gon Kim;Dong-Sik Woo;Sung-Kyun Kim;K. Kim
DOI：
10.1109/mwsym.2018.8439442
发表时间：
2018-06
期刊：
2018 IEEE/MTT-S International Microwave Symposium - IMS
影响因子：
--
作者：
Yutong Chu;Kaixue Ma;Yongqiang Wang
通讯作者：
Yutong Chu;Kaixue Ma;Yongqiang Wang
DOI：
10.1109/tmtt.1987.1133637
发表时间：
1987-03-01
影响因子：
4.3
作者：
GHIONE, G;NALDI, CU
通讯作者：
NALDI, CU
影响因子：
3
作者：
Jong-Hyuk Lee;Juseop Lee
通讯作者：
Jong-Hyuk Lee;Juseop Lee
影响因子：
0.4
作者：
L. G. Maloratsky
通讯作者：
L. G. Maloratsky