Diffusion induced void nucleation in SnPb solder joints
Diffusion induced void nucleation in SnPb solder joints
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SnPb 焊点中扩散引起的空洞成核
DOI：
10.1002/pamm.201710256
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发表时间：
2017
期刊：
影响因子：
--
通讯作者：
Kerstin Weinberg
中科院分区：
文献类型：
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作者：
Marek Werner;Kerstin Weinberg
为了建立一个简单而稳健的基于空洞的疲劳预测模型，我们采用多场方法研究了空洞与周围环境的相互作用。我们将tinc1和leadc2的浓度场与一个额外的场dc3耦合，其中后者被分配了一个空场。相互作用势表现出三种稳定状态。两个是由锡铅（SnPb）的实验结果得到的，并通过构造假设了空隙稳定状态。在本研究中，热力学一致的构型熵的对数形式由一个四阶多项式近似。结果表明，界面能系数与孔洞大小无关，而在数值上取决于本文模型中使用的网格尺寸。两个控制方程都遵循Cahn - Hilliard型方程来模拟微观结构的变化。（©2017 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim）
Towards a simple and robust model for void‐based fatigue prediction, we investigate the interaction of voids with its surrounding by using a multi‐field method. We couple the concentration fields of tinc1and leadc2with an additional fieldc3, where the latter is assigned with a void field. The interaction potential manifests three stable states. Two are obtained by experimental results of tin‐lead (SnPb) and the void stable state is postulated by construction. The logarithmic form of the thermodynamically consistent configurational entropy is approximated within this study by a fourth order polynom. It has been shown that the interfacial energy coefficient is independent of void's size, but rather depends numerically on the mesh size, which is used in the model presented here. Both governing equations follows a Cahn‐Hilliard‐type equation to mimic the microstructural changes. (© 2017 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)
无铅 SnâAgâCu 焊点中的空洞动态
DOI：
10.1002/pamm.201610296
发表时间：
2016
期刊：
PAMM
影响因子：
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作者：
Marek Werner;Thomas Reppel;Kerstin Weinberg
通讯作者：
Kerstin Weinberg