Columnar and nanocrystalline combined microstructure of the nitrided layer by active screen plasma nitriding on surface-nanocrystalline titanium alloy

Columnar and nanocrystalline combined microstructure of the nitrided layer by active screen plasma nitriding on surface-nanocrystalline titanium alloy
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纳米晶钛合金表面活性屏等离子渗氮氮化层柱状与纳米晶复合显微组织

DOI:
10.1016/j.apsusc.2023.156614
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发表时间:
2023-01
影响因子:
6.7
通讯作者:
Yan Gao
Yan Gao
中科院分区:
材料科学1区
文献类型:
--
作者:
Chengwei Zhang;Kai Wen;Yan Gao

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利用透射电镜研究了TA17钛合金表面纳米晶化后活性屏等离子渗氮层的组织结构和形成机理。原始和喷丸处理的TA17样品的氮化层由两个亚层组成:由氮化钛颗粒沉积形成的外部TiN层和由氮扩散到钛基体中形成的内部Ti2N层。Ti_2N层是一个贫Al区,这证明了其形成模式为氮扩散。与原始试样的TiN层中充满柱状晶相比,喷丸试样的TiN层主要由等轴纳米晶和少量柱状晶组成。喷丸表面上大量的高能晶界提供了大量的形核位置,导致等轴纳米TiN的形成。在长期渗氮过程中,大部分纳米级TiN晶粒由于其较高的热稳定性而得以保留,而喷丸处理后的基体表面的纳米级晶粒由于其较低的热稳定性而向微米级生长。随着氮化层厚度的增加,一些等轴TiN纳米晶由于竞争生长而生长成垂直于基体表面的柱状体。
The microstructure and formation mechanism of the nitrided layer by active screen plasma nitriding on surface-nanocrystalline TA17 titanium alloy were studied by TEM. The nitrided layer of both the original and shot-peened TA17 samples was composed of two sublayers: the outer TiN layer formed by deposition of titanium nitride particles and the inner Ti2N layer formed by nitrogen diffusion into the titanium substrate. The Ti2N layer was found to be an Al-depleted zone, which was a proof for its formation mode of nitrogen diffusion. Compared with the TiN layer of the original sample filled with columnar grains, the TiN layer of the shot-peened sample was composed of mainly equiaxed nanograins and a small amount of columnar grains. The large number of high-energy grain boundaries on the shot-peened surface provided numerous nucleation sites, resulting in the formation of equiaxed nanocrystalline TiN. During long term nitriding, most of the nano-scale TiN grains were maintained due to their high thermal stability, while the nano grains of the shot-peened substrate surface grew into microscale due to their low thermal stability. With the thickening of the nitrided layer, some equiaxed TiN nanograins grew into columns perpendicular to the substrate surface due to competitive growth.
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