High-Speed Complementary Integrated Circuit with a Stacked Structure Using Fine Electrodes Formed by Reverse Offset Printing
High-Speed Complementary Integrated Circuit with a Stacked Structure Using Fine Electrodes Formed by Reverse Offset Printing
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采用反向胶印形成的精细电极的堆叠结构的高速互补集成电路
DOI：
10.1021/acsaelm.9b00829
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发表时间：
2020
影响因子：
4.7
通讯作者：
Tokito Shizuo
中科院分区：
文献类型：
--
作者：
Takeda Yasunori;Sekine Tomohito;Wang Yi-Fei;Okamoto Tomoko;Matsui Hiroyuki;Kumaki Daisuke;Tokito Shizuo
在大面积衬底上制作了反向偏置印刷叠层结构互补环形振荡器和运算放大器电路。采用反向胶印法制作了宽度为30 μm、沟道长度为10 μm的均匀精细电极。与使用喷墨印刷构造的银纳米颗粒电极相比，可以形成宽度为1/5或更小的窄线。除了绝缘膜之外的所有组件都使用印刷法的溶液工艺形成。互补集成电路具有堆叠结构，其中p型有机薄膜晶体管（OTFT）堆叠在具有公共栅电极层的n型OTFT上。由于n型和p型OTFT的源极和漏极电极层是分开的，因此可以使用简单的方法处理不同的自组装单层。互补环形振荡器电路以2kHz（12.5V，五级）的频率振荡并以1.25V（96 Hz，九级）工作。所制造的OPA电路具有20的输出/输入电压比。此外，它的运行速度比喷墨打印形成的类似电路快40倍以上。通过反向胶印形成的精细电极对于提高印刷有机集成电路的性能和小型化是有用的。
A reverse offset-printed stacked-structure complementary ring oscillator and operational amplifier (OPA) circuits were constructed on a large-area substrate. Uniform and fine electrodes were fabricated using reverse offset printing with a width of 30 μm and a channel length of 10 μm. Compared to silver nanoparticle electrodes constructed using inkjet printing, a narrow line with a width of 1/5 or less could be formed. All components except the insulating film were formed using a solution process with the printing method. The complementary integrated circuit had a stacked structure, wherein a p-type organic thin-film transistor (OTFT) was stacked on an n-type OTFT with a common gate electrode layer. Because the source and drain electrode layers of the n- and p-type OTFTs were separated, different self-assembled monolayers could be treated using a simple method. The complementary ring oscillator circuit oscillated at a frequency of 2 kHz (12.5 V, five stages) and operated at 1.25 V (96 Hz, nine stages). The fabricated OPA circuit had an output/input voltage ratio of 20. Additionally, it operated over 40 times faster than a similar circuit formed by inkjet printing. Fine electrodes formed by reverse offset printing are useful for improving the performance and miniaturization of printed organic integrated circuits.
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影响因子：
--
作者：
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影响因子：
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作者：
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影响因子：
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作者：
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通讯作者：
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影响因子：
1.5
作者：
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通讯作者：
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影响因子：
2.3
作者：
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通讯作者：
H. Ushijima