Reducing the probe ball diameters of 3D silicon-based microprobes for dimensional metrology

Reducing the probe ball diameters of 3D silicon-based microprobes for dimensional metrology
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减小用于尺寸计量的 3D 硅基微探针的探针球直径

DOI:
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发表时间:
2013
期刊:
International Conference on Information Control Systems & Technologies
影响因子:
--
通讯作者:
Frank Härtig
Frank Härtig
中科院分区:
--
文献类型:
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作者:
N. Ferreira;A. Brennecke;A. Dietzel;S. Büttgenbach;T. Krah;D. Metz;K. Kniel;Frank Härtig

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基于硅力传感器的微探针系统可以在几μN或μm的范围内进行精确的力和位移测量。由于高灵敏度的扩散压敏电阻和适当的电路,这些探测系统能够进行触觉测量,而不会在探测表面留下划痕。为了探测工件上的微结构,寻求具有尽可能小的探测球的探针。大多数商业微探针具有直径为120 μm或更大的探针球。在这项工作中,微探针与探针球直径下降到50 μm,并详细描述。为了验证这些新的微探针的性能,已经进行了测量,以表征其机械行为和灵敏度。针对不同的传感器设计和探针球直径,对这些特性进行了广泛的分析。例如,具有50 μm的探针球直径的微探针在探针的X-Y方向上具有约0.637 mN/μm的刚度,并且在探针的Z方向上具有约20.023 mN/μm的刚度。在X-Y和Z方向上的灵敏度分别为1.174 mV/V/μm和20.478 mV/V/μm。提出的结果鼓励新一代的微探针用于尺寸计量。
Microprobing systems based on silicon force sensors allow accurate force and displacement measurements in the range of several μN or μm. Due to the high sensitive diffused piezoresistors and an appropriate electrical circuitry, these probing systems enable tactile measurement without leaving scratches on the probed surfaces. To probe microstructures on workpieces, probes with probe balls as small as possible are sought. Mostly, commercial microprobes have probe balls with diameters of 120 μm or larger. In this work, microprobes with probe ball diameters down to 50 μm are presented and characterized in detail. In order to verify the performance of these new microprobes, measurements have been carried out to characterize both their mechanical behavior and their sensitivity. These properties have been extensively analyzed for different sensor designs and probe ball diameters. For instance, microprobes with probe ball diameters of 50 μm have a stiffness of about 0.637 mN/μm in X-Y and about 20.023 mN/μm in Z directions of the probe. The sensitivity amounts to 1.174 mV/V/μm and 20.478 mV/V/μm in X-Y and Z directions, respectively. The results presented encourage a new generation of microprobes to be used in dimensional metrology.
DOI: 10.1088/0957-0233/25/6/064016
发表时间: 2014-06-01
影响因子: 2.4
作者:
Ferreira, N.;Krah, T.;Haertig, F.
通讯作者: Haertig, F.