Micromachined high frequency PMN-PT/epoxy 1-3 composite ultrasonic annular array.

Micromachined high frequency PMN-PT/epoxy 1-3 composite ultrasonic annular array.
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DOI:
10.1016/j.ultras.2011.11.001
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发表时间:
2012-04
期刊:
影响因子:
4.2
通讯作者:
Shung, K. Kirk
Shung, K. Kirk
中科院分区:
物理与天体物理2区
文献类型:
--
作者:
Liu, Changgeng;Djuth, Frank;Li, Xiang;Chen, Ruimin;Zhou, Qifa;Shung, K. Kirk

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本文报道了微型微机械高频PMN-PT/环氧树脂1-3复合超声环形阵列的设计、制作和性能。采用微机械加工技术制备了PMN-PT单晶1-3复合材料。单晶柱的面积为9 μm × 9 μm。柱之间的切口的宽度为约5 μm,并且切口填充有聚合物。复合材料厚度为25 μm。制作了等单元面积为0.2mm ~ 2、环缝宽度为16 μm的六单元环形换能器。阵列换能器的孔径尺寸为直径约1.5mm。实现了一种新的高密度阵列单元电互连策略。在将换能器附接到电连接板并封装之后,在脉冲/回波布置中测试阵列换能器,由此测量每个环的中心频率、带宽、双向插入损耗(IL)和相邻元件之间的串扰。中心频率为50 MHz,-6 dB带宽为90%。在50 MHz时,平均插入损耗为19.5 dB,相邻单元之间的串扰约为-35 dB。本文所描述的微机械加工技术是有前途的其他类型的高频换能器,如一维和二维阵列的制造。
This paper reports the design, fabrication, and performance of miniature micromachined high frequency PMN-PT/epoxy 1-3 composite ultrasonic annular arrays. The PMN-PT single crystal 1-3 composites were made with micromachining techniques. The area of a single crystal pillar was 9 μm × 9 μm. The width of the kerf among pillars was ~ 5 μm and the kerfs were filled with a polymer. The composite thickness was 25 μm. A six-element annular transducer of equal element area of 0.2 mm2 with 16 μm kerf widths between annuli was produced. The aperture size the array transducer is about 1.5 mm in diameter. A novel electrical interconnection strategy for high density array elements was implemented. After the transducer was attached to the electric connection board and packaged, the array transducer was tested in a pulse/echo arrangement, whereby the center frequency, bandwidth, two-way insertion loss (IL), and cross talk between adjacent elements were measured for each annulus. The center frequency was 50 MHz and -6 dB bandwidth was 90%. The average insertion loss was 19.5 dB at 50 MHz and the crosstalk between adjacent elements was about -35 dB. The micromachining techniques described in this paper are promising for the fabrication of other types of high frequency transducers e.g. 1D and 2D arrays.
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