In-situ reduction of silver by surface DBD plasma: a novel method for preparing highly effective electromagnetic interference shielding Ag/PET
In-situ reduction of silver by surface DBD plasma: a novel method for preparing highly effective electromagnetic interference shielding Ag/PET
复制标题
表面DBD等离子体原位还原银:制备高效电磁干扰屏蔽Ag/PET的新方法
DOI:
10.1088/2058-6272/abe200
复制
发表时间:
2021-03
影响因子:
1.7
通讯作者:
Xiuling Zhang
中科院分区:
文献类型:
--
作者:
Zhiyuan Fan;Lanbo Di;Decai Bu;Tengda Zhang;Xiuling Zhang
Electromagnetic interference (EMI) shielding composites with good flexibility and weatherability properties have attracted increased attention. In this study, we combined the surface modification method of sub-atmospheric pressure glow discharge plasma with in situ atmospheric pressure surface dielectric barrier discharge plasma (APSDBD) reduction to prepare polyethylene terephthalate supported silver (Ag/PET). Due to the prominent surface modification of PET film, mild plasma reduction, and effective control of the silver morphology by polyvinylpyrrolidone (PVP), a 3.32 μm thick silver film with ultralow sliver loading (0.022 wt%) exhibited an EMI shielding efficiency (SE) of 39.45 dB at 0.01 GHz and 31.56 dB at 1.0 GHz (>30 dB in the range of 0.01–1.0 GHz). The SEM results and EMI shielding analysis indicated that the high performance originated from the synergistic effect of the formation of silver nanoparticles (AgNPs) with preferentially oriented cell-like surface morphologies and layer-by-layer-like superimposed microstructures inside, which demonstrated strong microwave reflection properties. Fourier transform infrared spectrometer and x-ray diffractometer showed that the surface structures of the heat-sensitive substrate materials were not destroyed by plasma. Additionally, APSDBD technology for preparing Ag/PET had no special requirements on the thickness, dielectric constant, and conductivity of the substrate, which provides an effective strategy for manufacturing metal or alloy films on surfaces of heat-sensitive materials at a relatively low cost.
登录
查看更多内容
影响因子:
10.9
作者:
Fan, Chi;Wu, Bian;He, Daping
通讯作者:
He, Daping
影响因子:
15
作者:
Xia, Xiaohu;Zeng, Jie;Oetjen, L. Kyle;Li, Qingge;Xia, Younan
通讯作者:
Xia, Younan
影响因子:
4.6
作者:
Gao S;Chen X;Pan F;Song K;Zhao C;Liu L;Liu X;Zhao D
通讯作者:
Zhao D
影响因子:
9
作者:
Choi, Geunchang;Shahzad, Faisal;Seo, Minah
通讯作者:
Seo, Minah
影响因子:
9.9
作者:
Zongyuan Wang;Minyue Li;Wen Wang;Min Fang;Qi-di Sun;Chang‐jun Liu
通讯作者:
Zongyuan Wang;Minyue Li;Wen Wang;Min Fang;Qi-di Sun;Chang‐jun Liu