Noise and Bandwidth of 0.5-THz Twin Vertically Stacked SIS Junctions
Noise and Bandwidth of 0.5-THz Twin Vertically Stacked SIS Junctions
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0.5-THz 双垂直堆叠 SIS 结的噪声和带宽
DOI:
10.1109/tasc.2010.2096493
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发表时间:
2011-06
期刊:
影响因子:
--
通讯作者:
ChuangPing Chiu
中科院分区:
文献类型:
--
作者:
Jing Li;Hsian-Hong Chang;Sheng-Cai Shi;Dong Liu;Kang-Ming Zhou;MingJye Wang;Tse-Jun Chen;Chong-Wen Chen;Wei-Chun Lu;ChuangPing Chiu
Twin SIS (superconductor-insulator-superconductor) junctions, with a simple structure, yet large bandwidth and low noise temperature, have been widely used in millimeter- and submillimeter-wave heterodyne mixers. With increasing frequency, however, the length of the tuning inductance connecting the two individual SIS junctions becomes short while the junction area remains fixed. With a relatively short tuning inductance, the effect of the junction's spreading inductance becomes non-negligible, and device fabrication becomes more difficult. By adopting vertically stacked SIS junctions (VSJs), which have an equivalent geometric capacitance inversely proportional to the junction number, it becomes feasible to increase the junction tuning inductance. In this paper, we report on the design, fabrication, and characterization of twin Nb/Al-AlOx/Nb/Al-AlOx/Nb VSJs for the 500-GHz frequency band.
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DOI:
10.1007/bf01010970
发表时间:
1988-02
期刊:
International Journal of Infrared and Millimeter Waves
影响因子:
--
作者:
A. Kerr;S. Pan;M. Feldman
通讯作者:
A. Kerr;S. Pan;M. Feldman
影响因子:
4.3
作者:
R. Blundell;C. Tong;D. Papa;R. Leombruno;Xiaolei Zhang;S. Paine;J. Stern;H. Leduc;B. Bumble
通讯作者:
R. Blundell;C. Tong;D. Papa;R. Leombruno;Xiaolei Zhang;S. Paine;J. Stern;H. Leduc;B. Bumble
DOI:
--
发表时间:
2010
期刊:
--
影响因子:
--
作者:
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通讯作者:
S. Ochiai;K. Kikuchi;T. Nishibori;T. Manabe;H. Ozeki;K. Mizukoshi;Fumiaki Ohtsubo;Kazuyoshi Tsubosaka;Y. Irimajiri;R. Sato;M. Shiotani
影响因子:
1.8
作者:
Jing Li;M. Takeda;Zhen Wang;S. Shi
通讯作者:
Jing Li;M. Takeda;Zhen Wang;S. Shi
DOI:
10.1007/bf02084571
发表时间:
1993-05
期刊:
International Journal of Infrared and Millimeter Waves
影响因子:
--
作者:
V. Belitsky;S. Jacobsson;S. A. Kovtonjuk;E. Kollberg;A. Ermakov
通讯作者:
V. Belitsky;S. Jacobsson;S. A. Kovtonjuk;E. Kollberg;A. Ermakov