Influence of impurity gas seeding into deuterium plasma on the surface modification, sputtering erosion and deuterium retention in W and W-La2O3 alloy
Influence of impurity gas seeding into deuterium plasma on the surface modification, sputtering erosion and deuterium retention in W and W-La2O3 alloy
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氘等离子体中注入杂质气体对W和W-La2O3合金表面改性、溅射侵蚀和氘保留的影响
DOI：
10.1016/j.ijhydene.2022.10.107
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发表时间：
2022-11
影响因子：
7.2
通讯作者：
Peng Wang
中科院分区：
文献类型：
--
作者：
Xuexi Zhang;Li Qiao;Hong Zhang;Peng Wang
研究了钨(W)和W-1 wt.% La2O3（WL10）在纯D等离子体和含不同杂质（He、N2、Ar）的D等离子体中的表面改性、溅射侵蚀和氘(D)保留。等离子体照射后，WL10表面覆盖有形状各异的水疱，水疱的大小和密度随D浓度的增加而增大。当影响度大于8.6 × 1024D m−2时，出现水疱破裂，形成部分和/或完全打开的盖子特征。la2o3晶粒与W基体之间的相界面是表面附近起泡和大规模裂纹扩展的成核部位。小水泡优先出现在表面取向接近（111）的晶粒上，这些小水泡是由更接近样品表面深度的晶内裂纹引起的。高通量等离子体暴露后，WL10表面形成了微凹坑，这是由于等离子体暴露过程中la2o3颗粒的溅射速率较高。两种材料在D等离子体中注入He均能有效抑制水疱的形成，而在D等离子体中注入N时水疱的形成最为严重。当暴露于Ar + D等离子体时，W可见稀疏的小水泡，大部分水泡破裂，而WL10则有一些长条状的大水泡。W和WL10起泡行为的差异是由于la2o3相的存在导致的微观组织、成分和延展性的差异。在D等离子体中播种He，溅射产量略有增加。在D等离子体中添加n2和Ar可显著提高溅射产量。与W相比，WL10在溅射成品率方面表现出更好的抗溅射侵蚀能力。WL10的D保留率随D的增加而增加，在相同条件下，WL10的D保留率等于或低于W。
Surface modification, sputtering erosion and deuterium (D) retention were investigated of tungsten (W) and W-1 wt.% La2O3(WL10) that were exposed to pure D plasma and D plasma with different impurities (He, N2, Ar). After the plasma exposure, the surface of WL10 is covered by blisters with various shapes, and their size and density increase with D fluence. When the fluence was higher than 8.6 × 1024D m−2, the blister rupturing occurred causing a partially- and/or fully-opened lid features. The phase interface between La2O3grains and W matrix was served as the nucleation sites for blistering and large-scale crack propagation near the surface. Small blisters were preferentially appeared on the grains with surface orientation of nearly (111) and that originated from the intra-granular crack at depths much closer to the sample surface. Micro-sized pits were formed on the WL10 surface after exposure to high fluence plasma, which was due to a higher sputtering rate of La2O3grains during plasma exposure. For both materials, seeding He in D plasma can effectively inhibit the blister formation, and most serious blistering occurs with N seeding in D plasma. When exposed to Ar + D plasma, sparse small blisters were visible and most of blisters were ruptured for W, whereas there are some big blisters with long strip shape for WL10. The difference in blistering behavior between W and WL10 was attributed to the differences in microstructure, composition as well as ductility due to the presence of La2O3phases. The sputtering yields increased slightly with He seeding in D plasma. N2and Ar seeding in D plasma leaded to a significant increase in sputtering yields. As compared to the W, the WL10 exhibits a better sputtering erosion resistance in terms of the sputtering yield. The D retention in WL10 increases with D fluence and that was equal to or lower than that in W when exposed to the same conditions.
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影响因子：
3.3
作者：
S. Möller;D. Matveev;Y. Martynova;B. Unterberg;M. Rasinski;T. Wegener;A. Kreter;C. Linsmeier
通讯作者：
S. Möller;D. Matveev;Y. Martynova;B. Unterberg;M. Rasinski;T. Wegener;A. Kreter;C. Linsmeier
影响因子：
3.1
作者：
R. Liu;Yue Zhou;T. Hao;T. Zhang;Xuejiang Wang;C. S. Liu;Fang Qianfeng
通讯作者：
R. Liu;Yue Zhou;T. Hao;T. Zhang;Xuejiang Wang;C. S. Liu;Fang Qianfeng
影响因子：
3.3
作者：
Xuexi Zhang;L. Qiao;Hong Zhang;Yuhong Li;Peng Wang;Chang Liu
通讯作者：
Xuexi Zhang;L. Qiao;Hong Zhang;Yuhong Li;Peng Wang;Chang Liu
影响因子：
3.3
作者：
M. Reinhart;A. Kreter;B. Unterberg;M. Rasinski;C. Linsmeier
通讯作者：
M. Reinhart;A. Kreter;B. Unterberg;M. Rasinski;C. Linsmeier
影响因子：
3.1
作者：
Zhangjian Zhou;Jun Tan;D. Qu;G. Pintsuk;M. Rödig;J. Linke
通讯作者：
Zhangjian Zhou;Jun Tan;D. Qu;G. Pintsuk;M. Rödig;J. Linke