Preparation and characterization of magnetorheological elastic polishing composites
Preparation and characterization of magnetorheological elastic polishing composites
复制标题
磁流变弹性抛光复合材料的制备及表征
DOI:
10.1177/1045389x19835960
复制
发表时间:
2019-03
影响因子:
2.7
通讯作者:
Yi Liyin
中科院分区:
文献类型:
--
作者:
Xu Zhiqiang;Wang Qiuliang;Zhu Kejun;Jiang Shengqiang;Wu Heng;Yi Liyin
Magnetorheological elastic polishing composites, a new type of polishing material using magnetorheological elastomers as a binder, were developed to solve the problems of low processing efficiency and difficulty controlling the machining process in current polishing technology. A set of heat–magnet–force-coupled devices was designed and used to prepare isotropic and anisotropic silicon rubber–based magnetorheological elastic polishing composites by magnetic field–assisted compression molding technology. Then, the microstructure and properties of magnetorheological elastic polishing composites were characterized by X-ray diffraction, optical microscope, electronic universal testing machine, and microscratch tester. The results show that magnetorheological elastic polishing composite is a polymer-based composite composed of rubber and micro/nanoparticles, and the magnetic field applied during the preparation process causes the interior of the magnetorheological elastic polishing composites to appear as chains and columns formed by iron particles. The compressive elastic modulus and scratch resistance of magnetorheological elastic polishing composites increase with the increase in the surrounding magnetic field strength. The main reason for the above phenomena is related to the change in the microstructure of magnetorheological elastic polishing composites induced by an external magnetic field. Finally, a simple application of magnetorheological elastic polishing composites in polishing proves that magnetorheological elastic polishing composites can be applied to mechanical processing to achieve magnetically controlled polishing.
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DOI:
10.1016/s0890-6955(02)00143-8
发表时间:
2003
影响因子:
14
作者:
Wook-Bae Kim;Sung Jun Lee;Yong‐Jun Kim;E. S. Lee
通讯作者:
Wook-Bae Kim;Sung Jun Lee;Yong‐Jun Kim;E. S. Lee
影响因子:
5.1
作者:
Tsubasa Oguro;H. Endo;T. Kikuchi;M. Kawai;T. Mitsumata
通讯作者:
Tsubasa Oguro;H. Endo;T. Kikuchi;M. Kawai;T. Mitsumata
影响因子:
13.1
作者:
Irez, A. B.;Bayraktar, E.;Miskioglu, I.
通讯作者:
Miskioglu, I.
影响因子:
4.1
作者:
Genç, S;Phulé, PP
通讯作者:
Phulé, PP
影响因子:
6.2
作者:
Lian, Chenglong;Lee, Kwang-Hee;Lee, Chul-Hee
通讯作者:
Lee, Chul-Hee