How to solve problems in micro- and nanofabrication caused by the emission of electrons and charged metal atoms during e-beam evaporation

How to solve problems in micro- and nanofabrication caused by the emission of electrons and charged metal atoms during e-beam evaporation
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如何解决电子束蒸发过程中电子和带电金属原子发射引起的微纳加工问题

DOI:
10.1088/1361-6463/abe89b
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发表时间:
2021
期刊:
Journal of Physics D: Applied Physics
影响因子:
--
通讯作者:
B. Beschoten
B. Beschoten
中科院分区:
--
文献类型:
--
作者:
F. Volmer;I. Seidler;T. Bisswanger;J.-S. Tu;L.R. Schreiber;C. Stampfer;B. Beschoten

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我们讨论了电子束诱导物理气相沉积过程中电子和离子的发射如何引起微纳米加工过程中的问题。在简要概述了电子束蒸发器发出的不同类型的辐射以及辐射量如何取决于不同的沉积参数和条件之后,我们更详细地强调了两种现象:首先,我们讨论了由电子冲击电离电离的一部分金属蒸气引起的在抗蚀层下凹处的无意阴影蒸发。这些离子首先导致样品上无意的电荷积聚,这反过来又导致随后进入的电离金属原子向抗蚀剂的凹边产生静电偏转。其次,我们展示了金属化过程中的低能二次电子如何在电子束光刻过程中用于定义微纳米结构的相应抗蚀剂层中引起交联、水泡和气泡。金属沉积后,交联抗蚀剂可能会在剥离过程中导致严重的问题,并在器件上造成残留残留物。我们提供了一个关于如何最大限度地减少这些影响的故障排除指南,例如包括电子束的正确对准,避免坩埚中的污染,最重要的是,在蒸发室内安装偏转电极。
We discuss how the emission of electrons and ions during electron-beam-induced physical vapor deposition can cause problems in micro-and nanofabrication processes. After giving a short overview of different types of radiation emitted from an electron-beam (e-beam) evaporator and how the amount of radiation depends on different deposition parameters and conditions, we highlight two phenomena in more detail: First, we discuss an unintentional shadow evaporation beneath the undercut of a resist layer caused by the one part of the metal vapor which got ionized by electron-impact ionization. These ions first lead to an unintentional build-up of charges on the sample, which in turn results in an electrostatic deflection of subsequently incoming ionized metal atoms toward the undercut of the resist. Second, we show how low-energy secondary electrons during the metallization process can cause cross-linking, blisters, and bubbles in the respective resist layer used for defining micro-and nanostructures in an e-beam lithography process. After the metal deposition, the cross-linked resist may lead to significant problems in the lift-off process and causes leftover residues on the device. We provide a troubleshooting guide on how to minimize these effects, which eg includes the correct alignment of the e-beam, the avoidance of contaminations in the crucible and, most importantly, the installation of deflector electrodes within the evaporation chamber.
多孔固体的二次电子发射。
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