25.5 A 320GHz phase-locked transmitter with 3.3mW radiated power and 22.5dBm EIRP for heterodyne THz imaging systems
25.5 A 320GHz phase-locked transmitter with 3.3mW radiated power and 22.5dBm EIRP for heterodyne THz imaging systems
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适用于外差太赫兹成像系统的 25.5 A 320GHz 锁相发射机,辐射功率为 3.3mW,EIRP 为 22.5dBm
DOI:
10.1109/isscc.2015.7063118
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发表时间:
2015
期刊:
影响因子:
--
通讯作者:
E. Afshari
中科院分区:
文献类型:
--
作者:
R. Han;Chen Jiang;A. Mostajeran;Mohammad Emadi;Hamidreza Aghasi;H. Sherry;A. Cathelin;E. Afshari
Non-ionizing terahertz imaging using solid-state integrated electronics has been gaining increasing attention over the past few years. However, there are currently several factors that deter the implementations of fully-integrated imaging systems. Due to the lack of low-noise amplification above fmax, the sensitivity of THz pixels on silicon cannot match that of its mm-Wave or light-wave counterparts. This, combined with the focal-plane array configuration adopted by previous sensors, requires exceedingly large power for the illumination sources. Previous works on silicon have demonstrated 1mW radiation [1,3]; but higher power, as well as energy efficiency, are needed for a practical imaging system. In addition, heterodyne imaging scheme was demonstrated to be very effective in enhancing detection sensitivity [4]. Due to the preservation of phase information, it also enables digital beam forming with a small number of receiver units. This however requires phase locking between the THz source and receiver LO with a small frequency offset (IF<;1GHz). In [5], a 300GHz PLL is reported with probed output. In this paper, a 320GHz transmitter using SiGe HBTs is presented (Fig. 25.5.1). Combining 16 coherent radiators, this work achieves 3.3mW radiated power with 0.54% DC-RF efficiency, which are the highest among state-of-the-art silicon THz radiators shown in the comparison table in Fig. 25.5.6. Meanwhile, the output beam is phase-locked by a fully-integrated PLL, which enables high-performance heterodyne imaging systems.
DOI:
10.1109/isscc.2014.6757424
发表时间:
2014
期刊:
2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC)
影响因子:
--
作者:
U. R. Pfeiffer;Y. Zhao;J. Grzyb;R. Al Hadi;N. Sarmah;W. Förster;H. Rücker;B. Heinemann
通讯作者:
B. Heinemann
DOI:
10.1109/tthz.2011.2159559
发表时间:
2011-09-01
影响因子:
3.2
作者:
Friederich, Fabian;von Spiegel, Wolff;Roskos, Hartmut G.
通讯作者:
Roskos, Hartmut G.