Thermal Imaging Metrology with a Smartphone Sensor.

Thermal Imaging Metrology with a Smartphone Sensor.
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具有智能手机传感器的热成像计量学。

DOI:
10.3390/s18072169
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发表时间:
2018-07-06
期刊:
Sensors (Basel, Switzerland)
影响因子:
--
通讯作者:
Willmott JR
Willmott JR
中科院分区:
其他
文献类型:
--
作者:
Stanger LR;Wilkes TC;Boone NA;McGonigle AJS;Willmott JR

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热成像仪是昂贵的,特别是那些设计用于测量高温物体,测量不确定度低。广泛的研究和工业应用将受益于低成本的温度成像传感器与改进的计量。为了解决这个问题,我们提出了有史以来第一个基于智能手机传感器的超低成本热成像系统温度测量性能的量化方法。该相机采用了为智能手机相机市场开发的背照式硅互补金属氧化物半导体(CMOS)传感器。它被打包用于树莓派电脑。我们设计并安装了一个定制的三联镜头组件。该系统的性能采用了一系列最先进的技术和指标:在600-1000°C范围内建立了低于10°C的温度分辨率。此外,还考虑了组合不确定性的场景依赖方面。可以进行精确热测量的最小角强度被确定为1.35°,对应于距离1 m处的23 mm棒,或辐射温度计命名法中的45:1视场。
Thermal imaging cameras are expensive, particularly those designed for measuring high temperature objects with low measurement uncertainty. A wide range of research and industrial applications would benefit from lower cost temperature imaging sensors with improved metrology. To address this problem, we present the first ever quantification methodology for the temperature measurement performance of an ultra-low cost thermal imaging system based on a smartphone sensor. The camera was formed from a back illuminated silicon Complementary Metal Oxide Semiconductor (CMOS) sensor, developed for the smartphone camera market. It was packaged for use with a Raspberry Pi computer. We designed and fitted a custom-made triplet lens assembly. The system performance was characterised with a range of state-of-the-art techniques and metrics: establishing a temperature resolution of below 10 °C in the range 600–1000 °C. Furthermore, the scene dependent aspects of combined uncertainty were considered. The minimum angular subtense for which an accurate thermal measurement could be made was determined to be 1.35°, which corresponds to a 23 mm bar at a distance of 1 m, or 45:1 field-of-view in radiation thermometer nomenclature.
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