Preliminary investigation of Cr-coated F82H: Evolution of microstructure and mechanical properties at the F82H/Cr interface during solid-state diffusion bonding above Ac1 temperature
Preliminary investigation of Cr-coated F82H: Evolution of microstructure and mechanical properties at the F82H/Cr interface during solid-state diffusion bonding above Ac1 temperature
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Cr 涂层 F82H 的初步研究：Ac1 温度以上固态扩散接合过程中 F82H/Cr 界面微观结构和机械性能的演变
DOI：
10.1016/j.jnucmat.2023.154371
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发表时间：
2023
影响因子：
3.1
通讯作者：
Hiroaki Abe
中科院分区：
文献类型：
--
作者：
Reuben Holmes;Bo Li;Lijuan Cui;Sho Kano;Huilong Yang;Hiroaki Abe
采用高真空固态扩散连接技术，在1114 ~ 1323 K的温度范围内，对F82 H钢与纯Cr金属进行了60 min和1323 K下120 min的固态扩散连接。在所有温度下成功结合后，F82 H/Cr界面和互扩散区的特征在于使用SEM-EDS，TEM和EBSD分析，相对于扩散行为，化学成分和微观结构。在接头Cr侧形成了一层较薄的界面层，其厚度随连接温度的降低而减小，界面层中富含M23 C6，具有柱状和颗粒相混合的特征。Cr在F82 H中的扩散深度随连接温度的降低而减小。当温度≥1231 K时，由于Cr浓度增加和C贫化的综合稳定作用，在界面附近的F82 H区形成一层铁素体晶粒。在1114 K的最低结合温度下，由于Cr和C的扩散程度显著降低，整个F82 H中保留了板条马氏体显微组织。Cr在F82 H中的扩散系数在所有温度下都被测定，Cr在F82 H> Ac 1中扩散的活化能近似为225 KJ mol−1。最后，界面和互扩散区的硬度测试表明，在1114 K的最低温度下结合后，F82 H的性能得到保留，但是在较高的温度下，新形成的铁素体区域较软。需要进一步的研究，以了解硬M23 C6丰富的界面层对接头的机械性能的影响，以及是否可以最大限度地减少微观结构的变化，甚至消除，低于Ac 1温度。
Solid-state diffusion bonding was employed to join F82H steel and pure Cr metal under high vacuum at various temperatures above Ac1in the range 1114 to 1323 K for 60 min, and at 1323 K for 120 min. After successful bonding at all temperatures, the F82H/Cr interface and interdiffusion zone were characterised using SEM-EDS, TEM and EBSD analysis, with respect to diffusion behaviour, chemical composition and microstructure. A thin interface layer formed on the Cr side of the joint, which decreased in thickness with decreasing bonding temperature, and was rich in M23C6with mixed columnar and particulate nature. The depth of Cr diffusion into F82H decreased with decreasing bonding temperature. At temperatures ≥1231 K a layer of ferrite grains formed in the F82H region adjacent to the interface, due to the combined stabilising effect of enhanced Cr concentration and depleted C. At the lowest bonding temperature of 1114 K, a lath martensite microstructure was retained throughout the F82H due to a significantly lower extent of Cr and C diffusion. The diffusion coefficient of Cr in F82H was determined at all temperatures examined, and the activation energy of Cr diffusion in F82H >Ac1was approximated as 225 KJ mol−1. Finally, hardness testing of the interface and interdiffusion zone suggests the F82H properties were retained after bonding at the lowest temperature of 1114 K, however at higher temperatures the newly formed ferrite region was softer. Further research is required to understand the impact of the hard M23C6-rich interface layer on mechanical properties of the joint, and whether microstructural change can be minimised, or even eliminated, below the Ac1temperature.
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