Fabrication of ultra-thin nanostructured bimetallic foils by Accumulative Roll Bonding and Asymmetric Rolling.
Fabrication of ultra-thin nanostructured bimetallic foils by Accumulative Roll Bonding and Asymmetric Rolling.
复制标题
通过累积滚压和不对称滚压制造超薄纳米结构双金属箔
DOI：
10.1038/srep02373
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发表时间：
2013
影响因子：
4.6
通讯作者：
Kong, Charlie
中科院分区：
文献类型：
--
作者：
Yu, Hailiang;Lu, Cheng;Tieu, A. Kiet;Godbole, Ajit;Su, Lihong;Sun, Yong;Liu, Mao;Tang, Delin;Kong, Charlie
本文介绍了一种结合累积叠轧（ARB）和非对称轧制（AR）特点的新工艺。该技术已被开发用于生产超薄铝箔。最初，使用ARB在200°C下以50%的压下量辊压粘合1.5mm厚的AA1050和AA6061箔。 随后在室温下通过四个AR通道将所得的1.5mm厚的铝箔减薄至0.04mm。 上AR辊和下AR辊之间的速度比为1：1.3。观察到铝箔的拉伸强度随着厚度的减小而增加。当箔厚度从1.5 mm减小到0.14 mm时，箔的延展性被观察到降低，但是当厚度从0.14 mm进一步减小到0.04 mm时，箔的延展性增加。 在第三次AR通过后，AA 6061层的晶粒尺寸为约140 nm，AA 1050层的晶粒尺寸为约235 nm。
This paper reports a new technique that combines the features of Accumulative Roll Bonding (ARB) and Asymmetric Rolling (AR). This technique has been developed to enable production of ultra-thin bimetallic foils. Initially, 1.5 mm thick AA1050 and AA6061 foils were roll-bonded using ARB at 200°C, with 50% reduction. The resulting 1.5 mm bimetallic foil was subsequently thinned to 0.04 mm through four AR passes at room temperature. The speed ratio between the upper and lower AR rolls was 1:1.3. The tensile strength of the bimetallic foil was seen to increase with reduction in thickness. The ductility of the foil was seen to reduce upon decreasing the foil thickness from 1.5 mm to 0.14 mm, but increase upon further reduction in thickness from 0.14 mm to 0.04 mm. The grain size was about 140 nm for the AA6061 layer and 235 nm for the AA1050 layer, after the third AR pass.
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影响因子：
6
作者：
Saito, Y;Tsuji, N;Hong, RG
通讯作者：
Hong, RG
影响因子：
56.9
作者：
Rupert, T. J.;Gianola, D. S.;Hemker, K. J.
通讯作者：
Hemker, K. J.
影响因子：
8.4
作者：
Roy, Shibayan;Nataraj, B. R.;Chattopadhyay, K.
通讯作者：
Chattopadhyay, K.
DOI：
10.4028/www.scientific.net/msf.426-432.4435
发表时间：
2003-01-01
期刊：
THERMEC'2003, PTS 1-5
影响因子：
--
作者：
Benito, JA;Jorba, J;Roca, A
通讯作者：
Roca, A
影响因子：
29.4
作者：
Goeken, Mathias;Hoeppel, Heinz Werner
通讯作者：
Hoeppel, Heinz Werner