Characterization of free-standing nanocrystalline Ni55.2Mn24.7Ga19.9Gd0.2 high temperature shape memory thin film

Characterization of free-standing nanocrystalline Ni55.2Mn24.7Ga19.9Gd0.2 high temperature shape memory thin film
复制标题

自支撑纳米晶Ni55.2Mn24.7Ga19.9Gd0.2高温形状记忆薄膜的表征

DOI:
10.1016/j.jallcom.2015.11.191
复制
发表时间:
2016-03
影响因子:
6.2
通讯作者:
Jiehe Sui
Jiehe Sui
中科院分区:
材料科学2区
文献类型:
--
作者:
Jian Yao;Xiaohang Zheng;Wei Cai;Jiehe Sui

文献摘要

参考文献

被引文献

相似文献

采用直流磁控溅射和快速热退火(RTA)技术制备了纳米晶Ni55.2Mn24.7Ga19.9Gd0.2高温形状记忆薄膜。系统地研究了表面形貌、晶体结构、马氏体转变行为和形状记忆效应(SME)。结果表明,沉积态薄膜呈现非晶和纳米晶共存,而退火薄膜在室温下为单相七层调制马氏体结构,晶粒尺寸约为200-500 nm。退火后的薄膜呈现一步可逆马氏体相变,马氏体相变起始温度为 283 °C。相邻的层状变体表现出(202)I型孪晶关系和良好连贯的层间界面。退火后的Ni55.2Mn24.7Ga19.9Gd0.2薄膜在200℃以上表现出稳定的SME,可作为微机电系统(MEMS)器件应用于高温领域。
Nanocrystalline Ni55.2Mn24.7Ga19.9Gd0.2high temperature shape memory thin films had been prepared by the DC magnetron sputtering followed by rapid thermal annealing (RTA). Surface morphology, crystal structure, martensitic transformation behavior and shape memory effect (SME) were systematically investigated. The results showed that as-deposited film displayed a coexistence of amorphous and nanocrystal, while the annealed film was a single phase of seven-layered modulated martensite structure with the grain size about 200–500 nm at room temperature. The annealed film showed one step reversible martensitic transformation with martensitic transformation start temperature of 283 °C. Adjacent lamellar variants exhibited a (202) type Ι twin relationship and well coherent interlamellar interfaces. The annealed Ni55.2Mn24.7Ga19.9Gd0.2thin film displayed a stable SME above 200 °C, which could be used in high temperature field as micro-electro-mechanical-system (MEMS) devices.
DOI: 10.1016/j.actamat.2008.12.036
发表时间: 2009-04
期刊: Acta Materialia
影响因子: 9.4
作者:
H. Y. Kim;M. Mizutani;S. Miyazaki
通讯作者: H. Y. Kim;M. Mizutani;S. Miyazaki
DOI: 10.1016/j.msea.2013.12.081
发表时间: 2014-03
影响因子: 6.4
作者:
Xin Zhang;J. Sui;Xiaohang Zheng;Zheyi Yang;W. Cai
通讯作者: Xin Zhang;J. Sui;Xiaohang Zheng;Zheyi Yang;W. Cai
DOI: 10.1016/s0257-8972(01)01324-x
发表时间: 2001-08-01
影响因子: 5.4
作者:
Fu, YQ;Huang, WM;Gao, XY
通讯作者: Gao, XY
DOI: 10.1016/j.tsf.2006.07.153
发表时间: 2006-12
期刊: Thin Solid Films
影响因子: 2.1
作者:
M. Panduranga;D. Shin;G. Carman
通讯作者: M. Panduranga;D. Shin;G. Carman
DOI: 10.1016/j.tsf.2011.12.029
发表时间: 2012-02
期刊: Thin Solid Films
影响因子: 2.1
作者:
N. Jetta;N. Ozdemir;S. Rios;D. Bufford;I. Karaman;Xinghang Zhang
通讯作者: N. Jetta;N. Ozdemir;S. Rios;D. Bufford;I. Karaman;Xinghang Zhang