Effect of infiltrated eutectic AlSi on the microstructure and properties of C/C composites
Effect of infiltrated eutectic AlSi on the microstructure and properties of C/C composites
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共晶AlSi对C/C复合材料组织与性能的影响
DOI:
10.1177/0021998320969794
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发表时间:
2020-10
影响因子:
2.9
通讯作者:
Yu Gao
中科院分区:
文献类型:
--
作者:
Lei Liu;Boyan Li;Yongchun Guo;Xiyuan Yao;Wei Yang;Wei Feng;Xingyu Chen;Xiaotian Wei;Yu Gao
Eutectic AlSi alloy was pressure infiltrated into a porous C/C skeleton to develop a low cost new C/C composite for application without extreme high temperature. C/C composite possessed a density of 1.7 g/cm3was prepared for comparison. The effects of filling AlSi with and without Al-Ti-C grain refiner on the microstructure and properties of C/C composites were mainly studied. Result indicated that the introduced AlSi interpenetrated with C/C skeleton and made the composites compact. In comparison with C/C composite, the compressive strength and particle erosion resistance were greatly enhanced while the density and thermal expansion coefficient (CTE) increased slightly. After adding the refiner, Si network involved dendritic Al in C/C-AlSi was transformed to refined mixed AlSi, Al bulk and Si surrounded dendritic Al, and two kinds of micro-cracks came into being, which resulted in the decreased strength, improved erosion property and increased CTE of C/C-AlSiR. Both AlSi textures and micro-cracks in the modified C/C composites determined the crack propagation and led to their different compressive behaviors and anti-erosion abilities.
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影响因子:
16.6
作者:
Zeng Yi;Wang Dini;Xiong Xiang;Zhang Xun;Withers Philip J.;Sun Wei;Smith Matthew;Bai Mingwen;Xiao Ping
通讯作者:
Xiao Ping
影响因子:
5.2
作者:
O. Yaghobizadeh;A. Sedghi;H. Baharvandi
通讯作者:
O. Yaghobizadeh;A. Sedghi;H. Baharvandi
影响因子:
5.2
作者:
Yifan Ning;Shangwu Fan;Le Wang;Chenghua Luan;Juanli Deng;Litong Zhang;Laifei Cheng
通讯作者:
Laifei Cheng
DOI:
10.1016/j.compositesb.2018.10.016
发表时间:
2019-03
期刊:
Composites Part B: Engineering
影响因子:
--
作者:
Wei Zhou;Yang Li
通讯作者:
Yang Li
影响因子:
10.9
作者:
K. Manu;L. Raag;Rajan T.P.D.;B. C. Pai;P. Vijay;Namdeo Verma Shweta
通讯作者:
K. Manu;L. Raag;Rajan T.P.D.;B. C. Pai;P. Vijay;Namdeo Verma Shweta