Integrated High Power Modules
Integrated High Power Modules
复制标题
集成大功率模块
DOI：
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
P. Agyakwa
中科院分区：
文献类型：
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作者：
C. M. Johnson;A. Castellazzi;R. Skuriat;Paul L. Evans;Jianfeng Li;P. Agyakwa
从历史上看，电力电子领域的每一个学科都是独立发展的，因此，各个产品类别，如功率模块、无源元件、热管理系统、栅极驱动器和转换器，都是在没有充分考虑元件间相互作用的情况下开发的。这种设计和制造的串行方法已经达到了极限，只有通过更高水平的结构和功能集成才能取得进一步的进步。在本文中，我们研究了一些影响电力电子元件设计的基础技术，以及这些技术对实际集成水平的限制。热和电磁设计问题详细审查沿着与一些替代的方法和技术的模块组装。提出了一种灵活且可扩展的模块化方法，其中基于整流单元并添加适当的无源元件和传感器的功率基板与适当的热管理和栅极驱动技术并联和串联相结合，以提供广泛的功率模块解决方案。
Historically, each discipline in power electronics has been pursued independently, and as a result, individual product classes, such as power modules, passive components, thermal management systems, gate drives and converters, have been developed without full consideration of the inter-component interactions. This serial approach to design and manufacture has reached its limit and further advances will only be made through greater levels of structural and functional integration. In this paper we examine some of the underpinning technologies that influence the design of power electronic components and the constraints that these impose on the level of integration that is practicable. Thermal and electromagnetic design issues are examined in detail along with some alternative approaches and technologies for module assembly. A flexible and scalable modular approach is proposed in which power substrates, based on commutation cells with the addition of appropriate passive components and sensors, are combined in parallel and series with appropriate thermal management and gate-drive technologies to deliver a broad range of power module solutions.
影响因子：
9.4
作者：
Li, J. F.;Agyakwa, P. A.;Johnson, C. M.
通讯作者：
Johnson, C. M.