Incorporating crosslinks in fused filament fabrication: Molecular insight into post deposition reactions

Incorporating crosslinks in fused filament fabrication: Molecular insight into post deposition reactions
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在熔丝制造中加入交联:对沉积后反应的分子洞察

DOI:
10.1016/j.addma.2020.101746
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发表时间:
2021
影响因子:
11
通讯作者:
Dadmun, Mark D.
Dadmun, Mark D.
中科院分区:
工程技术1区
文献类型:
--
作者:
Perryman, S. Connor;Dadmun, Mark D.

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3D打印物体由于低的层间粘附力和导致其机械性能各向异性的缺陷而遭受固有的机械弱点。在这份报告中,我们研究了一个协议的能力,将层之间的共价键,以加强层间粘合力,通过沉积多胺层之间的熔丝制造印刷过程中。然后,多胺可以与沉积的长丝上的含氧官能团反应以在层之间形成共价交联。测定的界面断裂能和红外(IR)光谱研究表明,共价键的成功形成和加强层间界面与各种多胺。更重要的是,IR结果还阐明了胺与氧化长丝上发现的含氧官能团的反应的相对速率。这些结果表明,交联反应主要发生在长丝沉积后不久,即在高温下。数据还表明,胺的反应性不是决定界面强度的主要因素,因为交联剂的芳香性在产生更强的界面中起关键作用。因此,这些结果提供了重要的基础性理解,可用于将该方案应用于各种基于挤出的增材工艺和材料。
3D printed objects suffer from intrinsic mechanical weakness due to low interlayer adhesion and defects that result in anisotropy in their mechanical properties. In this report, we examine the ability of a protocol to incorporate covalent bonds between layers to strengthen interlayer adhesion by depositing multi-amines between layers during the fused filament fabrication printing process. The multi-amines may then react with oxygenated functional groups on the deposited filament to form covalent crosslinks between layers. Determination of the interfacial fracture energy and infrared (IR) spectroscopy studies indicate the successful formation of covalent bonds and strengthening of the interlayer interface with a variety of multi-amines. More importantly, IR results also elucidate the relative rate of reaction of the amines with oxygenated functional groups found on the oxidized filament. These results show that the crosslinking reactions primarily occur shortly after deposition of the filament, i.e. at elevated temperatures. The data also show that the reactivity of the amines is not the prevailing factor in determining interfacial strength, as the aromaticity of the crosslinker plays a key role in creating a stronger interface. These results therefore provide important foundational understanding that can be used to apply this protocol to a variety of extrusion based additive processes and materials.
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