Mg-implanted vertical GaN junction barrier Schottky rectifiers with low on resistance, low turn-on voltage, and nearly ideal nondestructive breakdown voltage
Mg-implanted vertical GaN junction barrier Schottky rectifiers with low on resistance, low turn-on voltage, and nearly ideal nondestructive breakdown voltage
复制标题
镁注入垂直 GaN 结势垒肖特基整流器,具有低导通电阻、低导通电压和近乎理想的无损击穿电压
DOI:
10.1063/5.0106321
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发表时间:
2022
影响因子:
4
通讯作者:
T. Kachi
中科院分区:
文献类型:
--
作者:
M. Matys;Kazuki Kitagawa;T. Narita;T. Uesugi;J. Suda;T. Kachi
Vertical GaN junction barrier Schottky (JBS) diodes with superior electrical characteristics and nondestructive breakdown were realized using selective-area p-type doping via Mg ion implantation and subsequent ultra-high-pressure annealing. Mg-ion implantation was performed into a 10 μm thick Si-doped GaN drift layer grown on a free-standing n-type GaN substrate. We fabricated the JBS diodes with different n-type GaN channel widths Ln = 1 and 1.5 μm. The JBS diodes, depending on Ln, exhibited on-resistance ( RON) between 0.57 and 0.67 mΩ cm2, which is a record low value for vertical GaN Schottky barrier diodes (SBDs) and high breakdown (BV) between 660 and 675 V (84.4% of the ideal parallel plane BV). The obtained low RON of JBS diodes can be well explained in terms of the RON model, which includes n-type GaN channel resistance, spreading current effect, and substrate resistance. The reverse leakage current in JBS diodes was relatively low 103–104 times lower than in GaN SBDs. In addition, the JBS diode with lower Ln exhibited the leakage current significantly smaller (up to reverse bias 300 V) than in the JBS diode with large Ln, which was explained in terms of the reduced electric field near the Schottky interface. Furthermore, the JBS diodes showed a very high current density of 5.5 kA/cm2, a low turn-on voltage of 0.74 V, and no destruction against the rapid increase in the reverse current approximately by two orders of magnitude. This work demonstrated that GaN JBS diodes can be strong candidates for low loss power switching applications.
影响因子:
4
作者:
Breckenridge, M. Hayden;Tweedie, James;Sitar, Zlatko
通讯作者:
Sitar, Zlatko
DOI:
10.1149/09806.0069ecst
发表时间:
2020
期刊:
ECS Transactions
影响因子:
--
作者:
Khachariya, Dolar;Szymanski, Dennis;Reddy, Pramod;Kohn, Erhard;Sitar, Zlatko;Collazo, Ramon;Pavlidis, Spyridon
通讯作者:
Pavlidis, Spyridon