Rapid Prototyping of Wireless Physical Layer Modules Using Flexible Software/Hardware Design Flow
Rapid Prototyping of Wireless Physical Layer Modules Using Flexible Software/Hardware Design Flow
复制标题
使用灵活的软件/硬件设计流程快速构建无线物理层模块原型
DOI:
10.1145/2684746.2689084
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发表时间:
2015
期刊:
影响因子:
--
通讯作者:
Dandekar, Kapil
中科院分区:
文献类型:
--
作者:
Chacko, James;Sahin, Cem;Pfiel, Douglas;Kandasamy, Nagarajan;Dandekar, Kapil
This paper describes a step by step approach in designing wireless physical layer modules starting from a software implementation in MATLAB to a hardware implementation using Xilinx SysGen and ModelSim. The described design flow promotes baseband physical layer research by providing high flexibility and speed to the process of module creation verification and deployment. The novelty introduced into our system lies within the flexible components created using this design flow, which enables on-the-fly modification of multiple parameters to suit various wireless protocols.
DOI:
10.1109/hpec.2014.7040969
发表时间:
2014-09
期刊:
2014 IEEE High Performance Extreme Computing Conference (HPEC)
影响因子:
--
作者:
James Chacko;Cem Sahin;D. Nguyen;Doug Pfeil;Nagarajan Kandasamy;K. Dandekar
通讯作者:
James Chacko;Cem Sahin;D. Nguyen;Doug Pfeil;Nagarajan Kandasamy;K. Dandekar
DOI:
10.1109/wiopt.2011.5930031
发表时间:
2011
期刊:
WiOpt 2011
影响因子:
--
作者:
Shishkin, Boris;Pfeil, Doug;Nguyen, Danh;Wanuga, Kevin;Chacko, James;Johnson, Jeremy;Kandasamy, Nagarajan;Kurzweg, Timothy P.;Dandekar, Kapil R.
通讯作者:
Dandekar, Kapil R.