Buckling-based measurements of mechanical moduli of thin films
Buckling-based measurements of mechanical moduli of thin films
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基于屈曲的薄膜机械模量测量
DOI：
10.3365/eml.2009.12.157
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发表时间：
2009
影响因子：
2.4
通讯作者：
D. Khang
中科院分区：
文献类型：
--
作者：
S. Hahm;H. Hwang;Donyoung Kim;D. Khang
本文综述了基于屈曲的材料力学性能测量方法，该方法对于薄膜、纳米或分子尺度材料等的表征是一种非常有用的技术，该方法可用于测量聚合物、聚电解质多层膜(PEM)、单壁碳纳米管(SWNT)和毫米厚的聚合物网络基板等各种薄膜的弹性模量。此外，还表明可以用屈曲方法测量各种有机电子材料的力学性能，这些材料可能在柔性和/或可拉伸的电子器件中有广泛的应用。由于其快速、简单的性质，该方法可以推广到许多其他材料，特别是只以薄膜形式存在的材料。该方法将是一种有价值的、补充材料力学特性的技术，将被添加到现有的方法，如拉伸测试、纳米压痕和其他方法。
The buckling-based measurement of mechanical properties of material is reviewed here, which is a very useful technique for the characterization of thin films, nano- or molecular-scale materials, etc. This method is shown to be useful to measure elastic moduli of various thin films such as polymers, polyelectrolyte multilayers (PEM), single-wall carbon nanotubes (SWNT) and millimeter-thick polymer network substrates. Further, it is also shown that the mechanical properties of various organic electronic materials, which may find wide applications in flexible and/or stretchable electronic devices, can be measured by the buckling method. Due to its fast, simple nature, the method can be extended to many other materials, especially to materials existing in thin film form only. The method would be a valuable, complementary technique in mechanical characterization of materials to be added to existing methods such as tensile testing, nano-indentation, and other methods.
影响因子：
56.9
作者：
Berger, Claire;Song, Zhimin;de Heer, Wait A.
通讯作者：
de Heer, Wait A.