The Preparation of High Saturation Magnetization and Low Coercivity Feco Soft Magnetic Thin Films via Controlling the Thickness and Deposition Temperature.
The Preparation of High Saturation Magnetization and Low Coercivity Feco Soft Magnetic Thin Films via Controlling the Thickness and Deposition Temperature.
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控制厚度和沉积温度制备高饱和磁化强度和低矫顽力Feco软磁薄膜
DOI：
10.3390/ma15207191
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发表时间：
2022-10-15
期刊：
影响因子：
--
通讯作者：
Zeng D
中科院分区：
文献类型：
--
作者：
Yang W;Liu J;Yu X;Wang G;Zheng Z;Guo J;Chen D;Qiu Z;Zeng D
具有高饱和磁化强度（4πMs）的FeCo薄膜可应用于薄膜电感器、微波噪声抑制器等高频电子器件。然而，由于FeCo的磁晶各向异性常数和磁致伸缩系数较大，导致FeCo薄膜的矫顽力(Hc)普遍较高，不利于软磁性能。同时，厚度和沉积温度对FeCo薄膜的矫顽力和饱和磁化强度有显着影响。本文采用磁控溅射技术在不同温度下制备了不同厚度的FeCo薄膜。系统研究了厚度和沉积温度对FeCo薄膜微观结构和磁性能的影响。当薄膜厚度从50 nm增加到800 nm时，矫顽力将从309 Oe降低到160 Oe。然而，饱和磁化强度从 22.1 kG 降低到 15.3 kG。之后，我们尝试进一步将沉积温度从室温（RT）提高到475°C。有趣的是，厚度为800 nm的薄膜的矫顽力从160 Oe大幅下降到3 Oe（下降了98％），饱和磁化强度从15.3 kG增加到23.5 kG（增加了53％）。对于厚度为50 nm的薄膜，矫顽力也大幅下降，从309 Oe降至10 Oe（下降了96%），但饱和磁化强度没有明显变化。它有助于沉积温度的升高，从而导致晶粒尺寸增大和晶界数量减少。并且矫顽力随着晶界数量的减少而降低。同时，对于较厚的薄膜，当提高沉积温度时，热应力增加，这改变了（200）织构的外观，并且饱和磁化强度增加。而对于小厚度（50 nm）薄膜的取向影响可以忽略不计。这表明高温沉积有利于FeCo薄膜的软磁性能，特别是对于厚度较大的薄膜。这种具有高饱和磁化强度和低矫顽力的 FeCo 薄膜可能是高频电子器件的理想选择。
FeCo thin films with high saturation magnetization (4 πMs) can be applied in high-frequency electronic devices such as thin film inductors and microwave noise suppressors. However, due to its large magnetocrystalline anisotropy constant and magnetostrictive coefficient of FeCo, the coercivity (Hc) of FeCo films is generally high, which is detrimental to the soft magnetic properties. Meanwhile, the thickness and deposition temperature have significant effects on the coercivity and saturation magnetization of FeCo films. In this paper, FeCo thin films with different thicknesses were prepared by magnetron sputtering at different temperatures. The effects of thickness and deposition temperature on the microstructure and magnetic properties of FeCo thin films were systematically studied. When the film thickness increases from 50 nm to 800 nm, the coercivity would decrease from 309 Oe to 160 Oe. However, the saturation magnetization decreases from 22.1 kG to 15.3 kG. After that, we try to further increase the deposition temperature from room temperature (RT) to 475 °C. It is intriguing to find that the coercivity greatly decreased from 160 Oe to 3 Oe (decreased by 98%), and the saturation magnetization increased from 15.3 kG to 23.5 kG (increased by 53%) for the film with thickness of 800 nm. For the film with thickness of 50 nm, the coercivity also greatly decreased from 309 Oe to 10 Oe (decreased by 96%), but the saturation magnetization did not change significantly. It is contributed to the increase of deposition temperature, which will lead to the increase of grain size and the decrease of the number of grain boundaries. And the coercivity decreases as the number of grain boundaries decreases. Meanwhile, for the thicker films, when increasing the deposition temperature the thermal stress increases, which changes the appearance of (200) texture, and the saturation magnetization increases. Whereas, it has a negligible effect on the orientation of thin films with small thickness (50 nm). This indicates that high-temperature deposition is beneficial to the soft magnetic properties of FeCo thin films, particularly for the films with larger thickness. This FeCo thin film with high saturation magnetization and low coercivity could be an ideal candidate for high-frequency electronic devices.
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