Determining the effect of burn-in process on reliability of X7R multilayer ceramic capacitors
Determining the effect of burn-in process on reliability of X7R multilayer ceramic capacitors
复制标题
确定老化过程对 X7R 多层陶瓷电容器可靠性的影响
DOI:
10.1007/s10853-022-07623-9
复制
发表时间:
2022
影响因子:
4.5
通讯作者:
Randall, Clive A.
中科院分区:
文献类型:
--
作者:
Yousefian, Pedram;Randall, Clive A.
Base metal electrode (BME) multilayer ceramic capacitors (MLCCs) continue to advance with higher volumetric capacitance, higher voltage, and higher-temperature operational ranges with greater numbers of capacitors being manufactured and integrated into the electronic infrastructure of society. Many of these applications range from aerospace, transport, computation, medical, satellite, military, and the internet of things means the interdependence of these devices require higher reliability at a collective and individual component level. Thus, determining the lifetime reliability of MLCCs is critical to provide more reliable components, and no weak links to the electrified infrastructure. For some of the more costly systems that support military and satellite systems, the reliability testing is very extensive. The burn-in test is a screening procedure used to remove components with higher probability of infant mortality failures. In this process, components are exposed to high temperatures and voltages relative to their design. The thermal stimulated depolarization current results revealed that burn-in test caused the intragranular and transgranular migration of oxygen vacancies, which will not be relaxed after the burn-in test. Time to failure data obtained through in situ highly accelerated lifetime tests demonstrated that not only burn-in tests were ineffective at detecting infant mortality failures, but they also had a negative impact on reliability of BME MLCCs by creating a weak population. The electromigration of oxygen vacancies during burn-in tests shorten the lifetime of MLCC population by reducing the protection effects of double Schottky barriers at the grain boundaries and electrode interfaces.
DOI:
10.1109/arms.1988.196476
发表时间:
1988
期刊:
1988. Proceedings., Annual Reliability and Maintainability Symposium,
影响因子:
--
作者:
Kam L. Wong;M. Beach;Dean L. Lindstrom
通讯作者:
Dean L. Lindstrom
影响因子:
3.9
作者:
W. Kuo;W. Chien;Taeho Kim
通讯作者:
Taeho Kim
影响因子:
7
作者:
W. Chien;C. Huang
通讯作者:
C. Huang